Processing method for improving flatness of soft and hard combined plate

A technology of soft and hard combination board and processing method, which is applied in the direction of electrical components, printed circuit manufacturing, printed circuit, etc., can solve the problems of poor shooting effect and low flatness precision, and achieve the effect of improving flatness and good shooting effect

Inactive Publication Date: 2016-10-26
台山市精诚达电路有限公司
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AI Technical Summary

Problems solved by technology

[0002] Nowadays, cameras are widely used in consumer electronics, and rigid-flex circuit boards with good flatness can provide high-definition shooting effects for the lens. In the process of conventionally manufacturing rigid-flex boards to control the flatness, silicone lamination is gen

Method used

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  • Processing method for improving flatness of soft and hard combined plate
  • Processing method for improving flatness of soft and hard combined plate

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Embodiment Construction

[0012] In order to describe the technical content, structural features, achieved goals and effects of the present invention in detail, the following will be described in detail in conjunction with the embodiments and accompanying drawings.

[0013] The most critical conception of the present invention is: the method of the present invention adopts the lamination of steel plate, kraft paper, PE film, aluminum sheet, separator, rigid-flex board, separator, aluminum sheet, PE film, kraft paper and steel plate from bottom to top It is a processing method that can effectively improve the flatness of rigid-flex boards.

[0014] see figure 1 , the present invention improves the processing method of the flatness of the rigid-flex board,

[0015] Including the following steps,

[0016] S1, stacking, place a steel plate on the table, place PE film, aluminum sheet, separator, soft and hard combination board, separator, aluminum sheet, PE film and steel plate in sequence on the steel pl...

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Abstract

The invention discloses a processing method for improving the flatness of a soft and hard combined plate. The method comprises the following steps of S1) lamination in which a steel plate is placed on a table top, and a piece of brown paper, a PE film, an aluminum sheet, a separating sheet, the soft and hard combined plate, another separating sheet, another aluminum sheet, another PE film, another piece of brown paper and another steel plate are placed on the steel plate successively; and S2) press fit in which the laminated plate of the step S1) is placed in a pressure transmission machine to implement press fit. According to the processing method, the steel plate, brown paper, PE film, aluminum sheet, separating sheet, soft and hard combined plate, separating sheet, aluminum sheet, PE film, brown paper and steel plate are laminated from bottom to top, routine materials are changed, so that during press-fit coating, the flat aluminum sheets can be used for coating, the flatness can be controlled within 30micron, the flatness is improved effectively, and a better shooting effect can be obtained even for a camera of the pixel of 20M.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a processing method for improving the flatness of a rigid-flex board. Background technique [0002] Nowadays, cameras are widely used in consumer electronics, and rigid-flex circuit boards with good flatness can provide high-definition shooting effects for the lens. In the process of conventionally manufacturing rigid-flex boards to control the flatness, silicone lamination is generally used. Or PE film (polyethylene film) is pressed and pressed. The disadvantage of this method is that the flatness accuracy is not high. Generally, it can be controlled at about 50um, which can meet the shooting requirements of cameras with 8M pixels. Powerless, poor shooting effect. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a processing method that can enhance the photographic effect and effectively improve the flatness o...

Claims

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Application Information

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IPC IPC(8): H05K3/00
CPCH05K3/0014H05K2203/068
Inventor 韩秀川刘振华
Owner 台山市精诚达电路有限公司
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