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Device and method for multi-point thermoforming of resin sheet

A resin-based, thermoforming technology, applied in the field of parts processing, which can solve the problems of poor versatility and high cost

Active Publication Date: 2019-08-09
SHANGHAI SPACE PRECISION MACHINERY RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to propose a multi-point thermoforming device and method for resin-based sheet materials in view of the disadvantages of traditional hot-press forming of resin-based three-dimensional skin parts that require specific equipment and molds, poor versatility, and high cost.

Method used

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  • Device and method for multi-point thermoforming of resin sheet
  • Device and method for multi-point thermoforming of resin sheet

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Embodiment

[0038] This embodiment provides a multi-point thermoforming device and method for a resin sheet, the multi-point thermoforming device for a resin sheet such as figure 1 As shown, a thermal expansion device 1 and a flexible mold device 12 are included.

[0039] The thermal expansion device 1 includes a thermal expansion box 2 , a silicone film layer 5 and a compressor 7 ;

[0040] The thermal expansion box 2 is provided with a heating rod 4, and the heating rod 4 is evenly arranged on the top of the thermal expansion box 2; the bottom of the thermal expansion box 2 is provided with an opening area, and the silicone film layer 5 is arranged at the opening area , the silica gel film layer 5 is riveted with the thermal expansion box 2, so that a closed chamber is formed in the thermal expansion box 2, and a closed space is provided for heating and pressurizing forming; Port 3; an air inlet 6 is arranged on the right side wall of the heating shaped box 2, and the thermal expansion...

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Abstract

The invention provides a multipoint hot forming device and method for a resin plank. The device comprises a hot-bugling device and a flexible mold device. The hot-bugling device is used for heating and pressurization of the resin plank. The flexible mold device is used for rapid formation of any three-dimensional curved surface resin plank forming mold. By the adoption of the device, organic integration of flexible shape adjustment, controllable temperature adjustment and uniform pressurization is achieved, and fast and flexible formation of the resin plank can be achieved. In addition, the invention provides the multipoint hot forming method for the resin plank. The multipoint hot forming method comprises six steps including shape adjustment through the flexible mold, plank material laying, heating, bulging, pressure maintaining and cooling. The high-quality, efficient and low-cost method is provided for formation of the resin plank through fast shape adjustment through the flexible mold and accurate control over the forming temperature and pressure.

Description

technical field [0001] The invention relates to the field of part processing, in particular to a device and method for multi-point thermoforming of resin plates. Background technique [0002] Resin materials have the characteristics of light weight, high strength, high modulus, fatigue resistance, corrosion resistance, designability, and good manufacturability. It is easy to manufacture large-scale overall structural parts, and has a wide range of applications in aviation, aerospace, automobiles, construction and other fields. . For example, in the field of aviation, resin materials have long been used in aircraft canopies and windshields, and are currently developing fully transparent resin material skinned aircraft; "Province" goal, requiring the mass of the payload to be increased from 40% to 70% of the mass of the aircraft. One of the measures is to use advanced resin-based composite materials instead of metal materials; in the automotive field, many brands of cars in t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C51/18B29C51/26B29C51/42B29C51/30
CPCB29C51/18B29C51/26B29C51/30B29C51/421
Inventor 彭赫力刘海建李中权张小龙袁勇王桃章
Owner SHANGHAI SPACE PRECISION MACHINERY RES INST