Automatic board unloader for electroplating device

Abstract

The invention discloses an automatic board unloader for an electroplating device. The automatic board unloader comprises a rack, a linear driving device, a transfer device, a suction cup device, an inductive control device and a board unloading sensory control device, wherein the linear driving device, the transfer device, the suction cup device, the inductive control device and the board unloading sensory control device are installed on the rack. The linear driving device can drive the transfer device to make linear movement between a taking position close to a board unloading position and a discharging position close to a board loading position. The suction cup device is provided with a rotary motor, a first cylinder, a second cylinder, a suction cup and a suction cup driving mechanism. According to the automatic board unloader for the electroplating device, a PCB which stops at the board unloading position can be automatically taken down from a clamp of the electroplating device and sent to the board loading position of a conveying face of an electroplating post treatment device; full-automatic operation can be conducted without manpower; and accordingly, the PCB production and processing efficiency is improved, manpower is reduced, and the cost is lowered.

Description

technical field [0001] The invention relates to an automatic unloading machine for electroplating equipment. Background technique [0002] Today, with the continuous upgrading of electronic products, various electrical equipment such as mobile phones, computers, TVs, and household appliances have entered our lives. PCB is an indispensable product in the electronics industry. improve. Labor costs have gradually increased. To achieve high production capacity, increase speed, increase yield, reduce costs, and optimize products, we can only replace humans with machines. [0003] After the electroplated copper plate comes out of the copper plating area, it needs to go through various post-processing equipment such as pickling, water washing, anti-oxidation, micro-etching, drying, drying, etc. Before that, the plate was manually taken out. If the thickness of the production plate is 0.036 mm ~ 0.1mm ultra-thin plate manual picking often occurs surface scratch deformation and po...

AI Technical Summary

Problems solved by technology

[0006] First, the company's labor costs have risen;

[0007] Second, the lower plate efficiency is not high;

[0008] Third, this work is a simple and repetitive mechanical action, and it is easy for people to make mistakes, resulting in serious scratches, deformation and pollution on the board surface when the board is removed, and the quality effect is not good

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