A hydrophilic/hydrophobic enhanced boiling heat exchanger with composite columnar microstructure

Abstract

The invention discloses a composite hydrophilic / hydrophobic enhanced boiling heat transfer sheet with a columnar microstructure. The composite hydrophilic / hydrophobic enhanced boiling heat transfer sheet comprises a hydrophobic region in a columnar micro-structural array and a smooth hydrophilic channel and is used for enhancing a boiling heat transfer process. The columnar microstructure of the micro-structural array can capture incondensable gas and provide a nucleation site of nucleate boiling in the boiling heat transfer process; steam bubbles grow in the hydrophobic region, slip and retain in the hydrophilic channel, gather and combine; when diameters of the steam bubbles increase to the order of magnitude of a width of the smooth hydrophilic channel, the steam bubbles separate from a smooth surface rapidly. Thus the separation of the steam bubbles is effectively promoted while the efficient heat transfer performance on the surface of the columnar microstructure is retained on a surface of the heat transfer sheet, and the wall superheat is reduced and the phenomenon of a boiling crisis is delayed.

Description

technical field [0001] The invention belongs to the field of thermal control of electronic devices, and in particular relates to a hydrophilic / hydrophobic enhanced boiling heat transfer sheet with a composite columnar microstructure, which effectively enhances the boiling heat transfer effect by changing the surface morphology and structure of the heat transfer sheet. Background technique [0002] With the development of micro-electro-mechanical technology, the degree of integration and high frequency of electronic devices has been continuously improved, the feature size has been continuously reduced, the heat generation per unit volume has been continuously increased, and the compact design of equipment makes heat dissipation more difficult. Boiling heat transfer is a phase-change heat transfer method. Compared with traditional air cooling and liquid convection heat transfer, the heat transfer coefficient has an order of magnitude difference, and it is a very effective heat ...

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Problems solved by technology

[0005] The purpose of the present invention is to provide a heat transfer surface structure with enhanced boiling heat transfer performance, which can effectively enhance the boiling heat transfer effect and delay the boiling dry burning phenomenon, and at the same time solve the problem of the existing boiling enhanced heat transfer surface being in contact with liquid for a long time. Changes in properties under high temperature working conditions

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