High-dielectric PBT (polybutylene terephthalate) material with epoxy resin adhesion and preparation method of material
A technology of epoxy resin and adhesion, which is applied in the field of high dielectric PBT materials and its preparation, can solve the problems of reduced packaging efficiency, difficulty in controlling the curing process of epoxy resin viscosity changes, etc., to reduce the dosage and improve the dielectric effect , the effect of reducing losses
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0025] Weighing: 70 kg of PBT, 18 kg of cardanolamine, 18 kg of polyvinyl alcohol microspheres, 6 kg of sodium dodecyl sulfonate, 6 kg of gelatin, 5 kg of nano metal powder, 4 kg of carbon nanotubes, silane coupling 2 kg of anti-oxidant and 2 kg of antioxidant 1076.
[0026] Specific steps are as follows:
[0027] (1), preparation of microcapsule curing agent:
[0028] ①. Under stirring conditions, add 0.5wt% gelatin aqueous solution and 0.5wt% sodium dodecylsulfonate aqueous solution, and disperse for 40 minutes under mechanical stirring at 800 rpm to obtain an aqueous phase;
[0029] 2. In the dichloromethane solvent, add cardanolamine and polyvinyl alcohol microspheres, and disperse evenly in an ultrasonic instrument to obtain an oil phase, and gradually add the water phase prepared in step 1 into the oil phase;
[0030] ③. Stir and emulsify the mixed solution for 60 minutes, raise the reaction temperature to 32°C and stir for 4 hours, then raise the temperature to 43°C a...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More