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Heat conduction type wave-absorbing material and preparing method thereof

A technology of wave-absorbing materials and substrates, applied in the field of heat-conducting wave-absorbing materials and their preparation, can solve problems such as poor thermal conductivity, failure to meet temperature rise requirements, poor uniformity, etc., and achieve good temperature resistance, good thermal conductivity, The effect of good thermal conductivity

Active Publication Date: 2016-11-16
GUANGDONG MIDEA KITCHEN APPLIANCES MFG CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] 1. The absorbing material is dispersed in a large amount of resin base, because the thermal conductivity of the resin is only about 0.2. After the absorbing material dispersed in it absorbs microwave energy and converts it into heat, it is difficult to transfer the heat quickly and evenly disperse it to the base material of the baking pan surface, so there will be problems of long baking time and poor uniformity;
[0005] 2. The wave-absorbing performance of the wave-absorbing material is average, and it cannot meet the requirement of heating up
The microwave-absorbing materials for microwave ovens or baking trays for microwave ovens are still limited to materials with high resin-based thickness (about 2 mm), traditional microwave-absorbing materials (ferrite, etc.), and poor thermal conductivity.
There are problems such as poor thermal conductivity, uneven temperature distribution, and unsatisfactory microwave absorption performance, which largely affect the application of baking pan-type microwave-absorbing materials in microwave ovens and microwave ovens.

Method used

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  • Heat conduction type wave-absorbing material and preparing method thereof

Examples

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Comparison scheme
Effect test

Embodiment 1

[0063] A heat-conducting wave-absorbing material, each component of the heat-conducting wave-absorbing material is calculated by mass percentage, the wave-absorbing material binder is 99.2%, the wave-absorbing material is 0.5%, and the additive is 0.3%.

[0064] The preparation method is as follows:

[0065] 1) Preparation of additives and binder mixing components:

[0066] Mix 99.2kg of liquid ceramic material with 0.3kg of additives; additives include 0.1kg of wetting and dispersing agent Disperbyk-161, 0.05kg of defoamer AMAFCA, 0.1kg of suspension thickener and 0.05kg of 1121 adhesion promoter; among them, The suspension thickener is a mixture of 0.05kg polyacrylamide and 0.05kg guar gum; mechanically stir at a speed of 300r / min for 5min to obtain a mixed solution;

[0067] 2) Preparation of heat-conducting and wave-absorbing materials:

[0068] Add 0.5 kg of graphene oxide wave-absorbing powder to the mixed liquid prepared in step 1), and mechanically stir at a speed of...

Embodiment 2

[0070] A heat-conducting wave-absorbing material, each component of the heat-conducting wave-absorbing material is calculated by mass percentage, the wave-absorbing material binder is 99.4%, the wave-absorbing material is 0.4%, and the auxiliary agent is 0.2%.

[0071] The preparation method is as follows:

[0072] 1) Preparation of additives and binder mixing components:

[0073] Mix 99.4kg of liquid ceramic material with 0.2kg of additives; additives include 0.06kg of wetting and dispersing agent Disperbyk-161, 0.04kg of defoamer AMAFCA, 0.07kg of suspension thickener and 0.03kg of 1121 adhesion promoter; among them, The suspension thickener is a mixture of 0.04kg polyacrylamide and 0.03kg guar gum; mechanical stirring at a speed of 300r / min for 5min to obtain a mixed solution;

[0074] 2) Preparation of heat-conducting and wave-absorbing materials:

[0075] Add 0.4 kg of graphene oxide wave-absorbing powder to the mixed solution prepared in step 1), and mechanically stir ...

Embodiment 3

[0077] A heat-conducting wave-absorbing material, each component of the heat-conducting wave-absorbing material is calculated by mass percentage, the wave-absorbing material binder is 99.3%, the wave-absorbing material is 0.4%, and the auxiliary agent is 0.3%.

[0078] The preparation method is as follows:

[0079] 1) Preparation of additives and binder mixing components:

[0080] Mix 99.3kg of liquid ceramic material with 0.3kg of additives; additives include 0.12kg of wetting and dispersing agent Disperbyk-161, 0.06kg of defoamer AMAFCA, 0.08kg of suspension thickener and 0.04kg of 1121 adhesion promoter; among them, The suspension thickener is a mixture of 0.05kg polyacrylamide and 0.03kg guar gum; mechanically stirred at a speed of 300r / min for 5min to obtain a mixed solution;

[0081] 2) Preparation of heat-conducting and wave-absorbing materials:

[0082] Add 0.4 kg of graphene oxide wave-absorbing powder to the mixed liquid prepared in step 1), and mechanically stir a...

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Abstract

The invention relates to a heat conduction type wave-absorbing material and a preparing method thereof. The heat conduction type wave-absorbing material comprises, by mass, 99.2-99.7% of wave-absorbing material binder, 0.2-0.5% of wave-absorbing material and 0.1-0.3% of auxiliary. The wave-absorbing material is a graphene material. During preparation, the components are mixed in proportion. The heat conduction type wave-absorbing material has the advantages that heat conduction property is good, temperature distribution is uniform, and wave-absorbing performance is good.

Description

technical field [0001] The invention belongs to the technical field of coatings, in particular to a heat-conducting wave-absorbing material and a preparation method thereof. Background technique [0002] With the improvement of people's living standards and the rapid improvement of food health requirements, more and more families use microwave ovens or microwave ovens with baking trays to bake pizza, chicken wings, biscuits and other foods. Therefore, the performance of the baking pan will directly affect the effect, taste and texture of baking and grilling food. [0003] Most of the microwave-absorbing materials used in the baking trays of existing microwave ovens or microwave ovens are to mix and disperse the microwave-absorbing powder in the resin, and solidify it on the surface of the metal or ceramic plate through high temperature to form a layer of microwave-absorbing material of about 2 mm, so as to achieve The baking pan absorbs microwave energy to achieve the purpo...

Claims

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Application Information

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IPC IPC(8): C09D1/00C09D7/12
CPCC09D1/00C09D7/61
Inventor 赵莉
Owner GUANGDONG MIDEA KITCHEN APPLIANCES MFG CO LTD
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