An anti-oxidation tin plating solution based on indium gallium phosphide

An anti-oxidation, indium gallium phosphide technology, which is applied in hot-dip plating process, coating, metal material coating process, etc. The problem of high cost of oxidizing agent can achieve the effect of low cost, improved wettability and improved productivity

Active Publication Date: 2019-05-17
XIAN TELISON NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the existing antioxidants on the market are relatively expensive, highly targeted, and the effect of antioxidation is not ideal, and they are mainly based on organic solvents, which will bring problems such as waste liquid recovery and environmental pollution. There are few practical use cases for improving the oxidation resistance of tin melts

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Take two parts of 100g tin plating solution, which are respectively recorded as 1# and 2#. Under the condition of temperature 230°C, add indium, gallium and phosphorus to 1# tin plating solution at the same time; among them, based on the weight of tin plating solution, The weight percentages of indium, gallium, and phosphorus added are respectively 0.01%, 0.06%, and 0.02%, and indium is added in the form of an indium-tin master alloy, and the indium content is 5% of the mass of the indium-tin master alloy; gallium Add in the form of gallium-tin master alloy, and the gallium content is 5% of the mass of the gallium-tin master alloy; phosphorus is added in the form of phosphorus-tin master alloy, and the phosphorus content is 5% of the mass of the phosphorus-tin master alloy 5%.

[0025] 2# tin plating solution is the blank control group. After oxidizing 1# and 2# tin plating solutions for 5 hours (oxidation conditions: heating at room temperature to 230°C, cooling to roo...

Embodiment 2

[0040] This embodiment takes the industrial tin-plated copper production line as an example. The tin furnace of the tin-plated copper production line contains 80kg of tin melt, and the temperature is 225-240°C. Add 0.16kg-0.64kg of 5% indium-tin master alloy, 0.16kg-0.96kg of 5% gallium-tin master alloy, and 0.32kg-0.64kg of 5% phosphorus-tin master alloy to obtain the oxidation-resistant tin plating solution; Hot-dip tinning on the oxygen-free copper strip at a speed of 80-120m / min.

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Abstract

The invention belongs to the technical field of metal antioxidation protection and particularly discloses an antioxidant tin plating solution containing the following components: indium, gallium, phosphorus and tin, wherein the weight percentages of indium, gallium and phosphorus are respectively 0.005-0.04%, 0.005-0.06% and 0.01-0.05% based on the weight of tin. Indium, gallium and phosphorus are added into the tin plating solution, so that the oxidation of the tin plating solution can be effectively inhibited, the generated tin residues can be reduced, and the effects of increasing the yield of tin products and the production rate of hot tinning products and the like are remarkable; meanwhile, the wettability of the tin plating solution is slightly improved, the melting points of the tin plating products are slightly reduced, and other physical and mechanical properties of the tin plating products are not affected; and the antioxidant tin plating solution is low in cost and meets the environment-friendly requirement, the existing production process is not changed, and the daily maintenance of the existing equipment and the working environment of a production place are not affected.

Description

technical field [0001] The invention relates to the technical field of metal anti-oxidation protection, in particular to an anti-oxidation tin plating solution based on indium gallium phosphide, which is mainly used for photovoltaic soldering strips. Background technique [0002] With the rapid development of the electronics industry, tin-based alloys are widely used in photovoltaic ribbons, electronic packaging and other fields because of their low melting point, good corrosion resistance, and good bonding with metal substrates. However, the liquid tin alloy in the molten state is easily oxidized to form tin dross and tin lumps, which contain a large amount of unoxidized tin, resulting in insufficient utilization of raw materials, production waste, increased production costs, and also affects product quality. In addition, during the production process of photovoltaic ribbon, the oxidation of tin alloy in the tin furnace will also cause color difference on the surface of the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C2/08C22C13/00
CPCC22C13/00C23C2/08
Inventor 张辉陈庆谊年有权孟瑜李少萌成佳佳刘艳洁孔伊莎
Owner XIAN TELISON NEW MATERIAL
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