High-power power supply apparatus equipped with thermal superconducting radiator

Abstract

The invention provides a high-power power supply apparatus equipped with a thermal superconducting radiator. The high-power power supply apparatus comprises the thermal superconducting radiator and power devices, wherein the thermal superconducting radiator adopts a composite board type structure; a thermal superconducting pipeline of a specific shape is formed in the thermal superconducting radiator; the thermal superconducting pipeline is a closed pipeline; the thermal superconducting pipeline is filled with a heat transfer working medium; and the power devices are attached to the surface of the thermal superconducting radiator. The thermal superconducting radiator provided by the invention has a rapid thermal conduction characteristic; an equivalent thermal conductivity coefficient of the thermal superconducting radiator can be greater than 4,000W / m DEG C, and uniform temperature of the overall thermal superconducting radiator can be realized; due to the advantages of high thermal conduction speed, small size, light weight, flexible structure, convenient installation, and the like of the thermal superconducting radiator, by application of the thermal superconducting radiator to the high-power power supply apparatus, the heat dissipation capability and the heat dissipation efficiency of the high-power power supply apparatus can be improved, and the internal space of a power supply casing is effectively utilized; and the rotating speed of a fan is lowered, or the use of a fan is not needed, so that noise is reduced.

Description

technical field [0001] The invention relates to the field of power supply technology, in particular to a high-power power supply device with a thermal superconducting radiator. Background technique [0002] With the rapid development of power electronics technology, the requirements for modularization, integration, lightweight, low cost and high reliability are getting higher and higher. Therefore, in household solar inverters, modular uninterruptible power supplies (UPS), High-power communication power supplies, small and medium power inverters, charging piles, power converters, active power filters (APF), reactive power compensators (SVG), etc. generally use low-cost and high-reliability discrete components that can work at high frequencies. Type power devices, such as MosFET, Diode, IGBT, etc. During the working process of high-power power supplies, discrete components such as switching tube rectifier bridges have a large amount of heat generated by themselves, which ser...

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Problems solved by technology

[0005] In order to solve the deficiencies of the prior art, the present invention proposes a high-power power supply device with a thermal superconducting heat sink, which is used to solve the problems of large volume, heavy weight, and cost in the prior art of using conventional finned heat sinks for heat dissipation. High and noisy, even by reducing the power of a single power device, increasing the number of power devices, to reduce the heat flux density of a single power device and other issues

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