Top-blown heat pipe radiator and its manufacturing method

A heat pipe radiator, top-blown technology, applied in the direction of cooling/ventilation/heating transformation, equipment, instrument cooling, etc., can solve the problem of not meeting the heat dissipation performance of the radiator, large temperature difference of the radiator, and low heat dissipation efficiency and other issues, to achieve the effect of light weight, large heat dissipation capacity, and improved heat dissipation efficiency
CN1744806AInactive Publication Date: 2006-03-08嘉善华昇电子热传科技有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
嘉善华昇电子热传科技有限公司
Publication Date
2006-03-08
Estimated Expiration
Not applicable · inactive patent

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Abstract

The radiator includes heat pipe, basal body of thermal fin, and fan. There are through holes inside basal body of thermal fin, and heat pipes are setup in through holes. Inner diameter of through hole is close fitted to external diameter of heat pipe. Multiple radial thermal fins are setup around. Being setup on top of basal body of thermal fin, fan is in use for forcing air to pass through radial thermal fins from upper to lower. Being in mode of evaporation condensed phase change, heat pipe conducts heat, providing features of quick conduction rate, large heat transfer power. Multiple radial thermal fins possess large area of dissipation. Forced air driven by fan passes through radial thermal fins in small wind resistance. Features of the invention are: large heat sinking capability, small thermal resistance, and lightweight.
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Description

Technical field

[0001] The invention relates to a heat dissipation device, in particular to a top-blowing type heat pipe radiator for heating electronic components (including a personal computer CPU) and a manufacturing method. Background technique

[0002] At present, a widely used electronic component radiator is an aluminum extruded sunflower radiator. The radiating fins are distributed radially outwards along the axial direction. The center is a hole through up and down, and a solid or hollow hole is arranged in the center hole. Copper pillar. The heating surface of the electronic component is directly in contact with the bottom surface of the copper column, and the heat generated during the operation of the electronic component is transferred to the aluminum heat sink by the heat conduction of the copper column, and the fan forces the air to flow through the heat sink to dissipate the heat into the air.

[0003] Because the center of the radiator is a copper column with good...

Claims

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