LED chip structure and manufacturing method thereof

Abstract

The invention provides an LED chip structure and a manufacturing method thereof. The manufacturing method comprises that a substrate including a front side and a back side is provided; an N type semiconductor layer, an active layer and a P type semiconductor layer are formed successively; an N electrode and a P electrode are formed; and a buffer layer whose reflective index is lower than that of the substrate is formed. The LED structure comprises the substrate, an N type semiconductor layer, an active layer, a P type semiconductor layer, the N electrode, the P electrode and the buffer layer, wherein the N electrode and the P electrode are electrically connected with the N type semiconductor layer and the P type semiconductor layer respectively, and the buffer layer is formed in the back side of the substrate. The LED chip structure and the manufacturing method thereof have the advantages that the buffer layer whose refractive index is lower than that of the substrate is added, the possibility that light transmitted from the substrate generates total reflection is reduced, the possibility that light generates total reflection at the surface of the substrate is reduced, the light transmissivity is improved, and further the brightness of the LED chip structure is improved.

Description

technical field [0001] The invention relates to the technical field of LED manufacturing, in particular to an LED chip structure and a manufacturing method thereof. Background technique [0002] A light emitting diode (Light Emitting Diode, LED) is a semiconductor solid-state light-emitting device, which is made using the principle of semiconductor PN junction electroluminescence. LED devices have good photoelectric properties such as low turn-on voltage, small size, fast response, good stability, long life, and no pollution. Therefore, they are widely used in outdoor and indoor lighting, backlighting, display, traffic indication and other fields. [0003] Generally speaking, the LED chip structure is divided into three types: horizontal structure (front chip), vertical structure (vertical structure chip) and flip chip structure (flip chip); among them, the P and N electrodes in the flip structure LED chip are located On the same side of the light-emitting area, the light e...

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Problems solved by technology

[0004] However, even if the existing LED chip structure is changed to the above-mentioned flip-chip structure, its luminous efficiency is still not ideal.

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