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Packaging method of flexible display

A flexible display and packaging method technology, applied in the direction of electric solid devices, semiconductor devices, organic semiconductor devices, etc., can solve the problems of easy failure of adhesive materials, and achieve the effect of firm bonding

Inactive Publication Date: 2016-11-23
EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above method uses new materials and processes to bond various films that make up the flexible display together, and solves the problem that the adhesive material is prone to failure in the prior art

Method used

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  • Packaging method of flexible display
  • Packaging method of flexible display
  • Packaging method of flexible display

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Experimental program
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Embodiment Construction

[0028] The packaging method of the flexible display of the present invention will be described in detail below with reference to the accompanying drawings.

[0029] The encapsulation method of the flexible display of the present invention uses a silicon-based material to bond together the multi-layer flexible film layers used for encapsulating the flexible display. The encapsulation method of the flexible display includes the following steps:

[0030] Such as figure 2 As shown, at least one first flexible film layer 21 and one second flexible film layer 22 are first provided, the first flexible film layer 21 has a first encapsulation surface, and the second flexible film layer 22 has a second encapsulation surface. A silicon-based material layer 23 is prepared on the first packaging surface and the second packaging surface respectively. The silicon-based material layer 23 is prepared on the surface to be bonded of the first flexible film layer 21 and the second flexible fil...

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PUM

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Abstract

The invention discloses a packaging method of a flexible display. The method comprises that at least a first flexible thin film layer and a second flexible thin film layer are provided, the first flexible thin film layer includes a first packaging surface, and the second flexible thin film layer includes a second packaging surface; silicon-based material layers are prepared on the first packaging surface and the second packaging surface respectively; and ion beams are emitted to the silicon-based material layers on the first and second packaging surfaces, and the first packaging surface is bonded to the second packaging surface, so that the silicon-based material layer of the first packaging surface is combined with the silicon-based material layer of the second packaging surface. According to the invention, a recombination technology of the silicon-based materials enables that two films are bonded, the bonding manner is firmer compared with a traditional bonding manner via glue materials, and the bonded layers tend not to be peeled and are prevented from moisture and oxygen.

Description

technical field [0001] The invention relates to a method for manufacturing a flexible display device, in particular to a packaging method for a flexible display. Background technique [0002] Organic electroluminescent devices (OLEDs) have become the most promising new display devices in recent years due to their advantages of all solid state, self-luminescence, no need for backlight, low driving voltage, high efficiency, and ultra-thin and flexible displays. Using flexible substrates to make bendable, light-weight, and portable flexible display devices is an important development direction of organic electroluminescent devices (OLEDs). Since the electrode materials and luminescent materials of organic electroluminescent devices are sensitive to oxygen and water vapor, the existence of oxygen and water vapor in the device is the main factor affecting the life of the device. Therefore, suitable packaging substrates and packaging methods are used to protect organic electrolumi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/56H01L21/56H10K99/00
CPCH10K71/50H10K2102/311H10K59/871H10K50/841
Inventor 施秉彝张明月
Owner EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD