An air energy bga soldering station heating base

A heating base and air energy technology, which is applied in electrical components, circuit heating devices, printed circuit maintenance/calibration, etc., can solve the problems of large power consumption and waste heat of BGA rework stations, so as to reduce power consumption and waste heat emission , the effect of prolonging the service life

Active Publication Date: 2018-09-21
GUANGXI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the above-mentioned defects that the BGA rework station consumes a lot of power and produces a large amount of waste heat, the present invention provides an air-powered BGA rework station

Method used

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  • An air energy bga soldering station heating base
  • An air energy bga soldering station heating base

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Embodiment Construction

[0016] The technical solution of the present invention will be further elaborated below through an embodiment of a BGA soldering station with three temperature zones.

[0017] An air energy BGA soldering station heating base, including a base body 3, a base bottom plate 10 and a heat gun 2, and also includes a plurality of semiconductor cooling sheets 5 and a plurality of heat conducting copper plates 4, the first layer above the base bottom plate 10 is a semiconductor cooling sheet 5. The rest of the heat-conducting copper plates 4 and the semiconductor cooling sheets 5 are stacked alternately on the first layer of semiconductor cooling sheets 5, the uppermost layer is the heat-conducting copper plate 4, the cold ends of each layer of semiconductor cooling sheets 5 are consistent downward, and the heat gun 2 is installed at the bottom Above the upper heat conduction copper plate 4. The circuit board 1 to be soldered is located above the heat gun 2 .

[0018] It also includes...

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PUM

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Abstract

The invention relates to a heating base of an air-energy BGA (Ball Grid Array) soldering station. The heating base comprises a base body, a base bottom plate and a hot air gun. The heating base further comprises multiple semiconductor refrigeration sheets and multiple heat-conducting copper plates, wherein a first layer on the base bottom plate is a semiconductor refrigeration sheet, the rest heat-conducting copper plates and semiconductor refrigeration sheets are superposed on the first layer of semiconductor refrigeration sheet in a staggered manner, the uppermost layer is a heat-conducting copper plate, the cold ends of the semiconductor refrigeration sheets of all layers are downward consistently, and the hot air gun is mounted above the heat-conducting copper plate of the uppermost layer. A circuit board to be soldered is located above the hot air gun. According to the heating base of the air-energy BGA soldering station, the semiconductor refrigeration sheets are used for absorbing part of heat from surrounding air, the air is preheated and then is heated to working temperature of a chip soldering area by an air blower so as to heat the circuit board, and the heat-absorbed cooled air is used for cooling components and parts in a circuit, so that the service lives of the components and parts are prolonged, and the aims of lowering power consumption and reducing waste heat discharge are achieved.

Description

technical field [0001] The invention relates to a heating base of a BGA soldering station, which is the main part of the BGA soldering station. The BGA soldering station is generally also called the BGA rework station. It is a special equipment used when the BGA chip has soldering problems or needs to be replaced with a new BGA chip. It is used to heat the circuit board to a suitable temperature (about 180 degrees). Background technique [0002] BGA (Ball Grid Array, solder ball array package) rework station is a professional tool for repairing faulty BGA components. The mainstream heating methods in the world include full infrared, full hot air, and two hot air and one infrared. At present, these heating methods have their own advantages. The heating method of domestic BGA rework stations is generally upper and lower hot air, and three temperature zones for infrared preheating at the bottom (BGA rework stations with two temperature zones only have upper hot air and bottom ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K3/34H05K3/22
CPCH05K1/0212H05K3/225H05K3/34H05K2203/111
Inventor 贺德强刘旗扬苗剑刘斌其他发明人请求不公开姓名
Owner GUANGXI UNIV
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