An air energy bga soldering station heating base
A heating base and air energy technology, which is applied in electrical components, circuit heating devices, printed circuit maintenance/calibration, etc., can solve the problems of large power consumption and waste heat of BGA rework stations, so as to reduce power consumption and waste heat emission , the effect of prolonging the service life
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[0016] The technical solution of the present invention will be further elaborated below through an embodiment of a BGA soldering station with three temperature zones.
[0017] An air energy BGA soldering station heating base, including a base body 3, a base bottom plate 10 and a heat gun 2, and also includes a plurality of semiconductor cooling sheets 5 and a plurality of heat conducting copper plates 4, the first layer above the base bottom plate 10 is a semiconductor cooling sheet 5. The rest of the heat-conducting copper plates 4 and the semiconductor cooling sheets 5 are stacked alternately on the first layer of semiconductor cooling sheets 5, the uppermost layer is the heat-conducting copper plate 4, the cold ends of each layer of semiconductor cooling sheets 5 are consistent downward, and the heat gun 2 is installed at the bottom Above the upper heat conduction copper plate 4. The circuit board 1 to be soldered is located above the heat gun 2 .
[0018] It also includes...
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