Quartz plate outer circle polishing machine

A quartz chip and grinding machine technology, which is applied in the direction of grinding racks, grinding machine parts, and machine tools designed for grinding the rotating surface of workpieces, etc., can solve the problems affecting the processing environment and achieve good anti-sputtering effect, The effect of reducing the rebound height and firm clamping

Active Publication Date: 2016-11-30
HUZHOU OPAL QUARTZ TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage is that the device can only hold cylindrical workpieces, and the debris bounces off the bed during grinding and sputters outwards, which affects the processing environment

Method used

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  • Quartz plate outer circle polishing machine
  • Quartz plate outer circle polishing machine
  • Quartz plate outer circle polishing machine

Examples

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Embodiment Construction

[0020] The following specific examples are only explanations of the present invention, and it is not a limitation of the present invention. Those skilled in the art can make modifications without creative contribution to the present embodiment as required after reading this specification, but as long as they are within the rights of the present invention All claims are protected by patent law.

[0021] Examples such as figure 1 Shown, a kind of quartz wafer cylindrical grinding machine, comprises clamping device 3, grinding device 1 and positioning device 2, and described grinding device 1 comprises grinding wheel 12, the grinding bracket 11 that installs described grinding wheel 12 and drives grinding wheel 12 to rotate Grinding motor 13, the bottom of described emery wheel 12 is provided with collecting box 4.

[0022] The clamping device 3 includes a clamping disc clamped on both sides of the quartz plate and a clamping seat 31 for installing the clamping disc, the clampin...

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Abstract

The invention relates to the technical field of outer circle polishing equipment, in particular to a quartz plate outer circle polishing machine. The quartz plate outer circle polishing machine comprises a clamping device, a polishing device and a positioning device; the clamping device comprises clamping discs and a clamping base, the clamping base is arranged on the positioning device, and the clamping discs are rotationally mounted on the clamping base; the clamping discs comprise the driving clamping disc and the driven clamping disc, the driven clamping disc and the driving clamping disc synchronously rotate through a synchronizer, the rotating direction of the clamping discs is identical to that of a grinding wheel, and the clamping discs carry out intermittent rotation. An inclined angle of 45 degrees to 60 degrees is formed between the connecting line between the rotating centers of the clamping discs and the rotating center of the grinding wheel and the horizontal plane. According to the quartz plate outer circle polishing machine, the rebounding height of grindings entering a collecting box relative to the bottom of the collecting box can be effectively reduced, the sputtering preventing effect is good, the clamping discs carry out intermittent rotation, sufficient polishing time can be provided, the polishing effect is good, a quartz plate is firmly clamped, and the surface of the quartz plate is protected against abrasion.

Description

technical field [0001] The invention relates to the technical field of cylindrical grinding equipment, in particular to a cylindrical grinding machine for quartz wafers. Background technique [0002] Ordinary cylindrical grinders mostly use centerless grinding, which is very effective for small products, especially workpieces whose metal materials are not afraid of collision or damage. If it is a slightly larger workpiece, the equipment price of this kind of grinding machine is very high. For products that are fragile and not suitable for collision, such as quartz wafers and monocrystalline silicon, special clamping and positioning devices are required. For example: the application number is 200820168952.4 a kind of monocrystalline silicon rounding device described in Chinese utility model, including machine tool body, driving device, emery wheel, tailstock, monocrystalline silicon product, one end of the described driving device is provided with a main chuck An auxiliary c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B5/04B24B5/35B24B5/50B24B55/12B24B41/06B24B41/02B24B47/12B24B47/22
CPCB24B5/04B24B5/35B24B5/50B24B41/02B24B41/062B24B47/12B24B47/22B24B55/12
Inventor 盛文彬唐忠民
Owner HUZHOU OPAL QUARTZ TECH
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