Weldability test dynamometry tool with solder position convenient to adjust

Abstract

The invention discloses a weldability test force-measuring tool for adjusting the position of solder, which comprises a balance mechanism with a first iron core and a second iron core suspended at both ends, the first iron core is connected to a sample fixture, and a displacement sensor is arranged on the side. An electromagnetic coil is arranged on the side of the second iron core; it also includes a controller and an amplifier circuit; the displacement sensor detects the displacement of the first iron core and transmits it to the controller; the controller transmits the received signal of the displacement sensor to the recorder through A / D conversion device; at the same time, the received displacement sensor signal is linearly converted into current output and transmitted to the amplifying circuit; the amplifying circuit amplifies the passed current and transmits it to the electromagnetic coil. And through the solder containing part, the solder tank can be moved and adjusted in four directions. The invention is used to realize the purpose of improving the reset sensitivity of the force measuring system of the solderability tester and at the same time facilitating the adjustment of the position of the solder.

Description

technical field [0001] The invention relates to the field of weldability testers, in particular to a force-measuring tool for weldability testing which is convenient for adjusting the position of solder. Background technique [0002] Solderability test refers to the qualitative and quantitative evaluation of the solderability of components, PCB boards, PADs, solders and fluxes, etc. through the wetting balance method. Both level 1 (IC packaging) and level 2 (assembly of electronic components to printed circuit board) processes in the modern electronics industry require high-quality interconnection technology, as well as high-quality and zero-defect soldering processes. Solderability testing is generally used to make a qualitative and quantitative evaluation of the solderability of components, printed circuit boards, solder and flux, etc. In the assembly welding process of electronic products, the welding quality directly affects the quality of the whole machine. Therefore,...

AI Technical Summary

Problems solved by technology

However, the force measurement system of the existing solderability tester has a slow automatic reset speed and needs to be improved; at the same time, it is necessary to insert the tested sample into the solder to measure the buoyancy and wetting tension, and the temperature of the solder in the molten state Higher, it is not easy to adjust by manpower, once the length of the tested sample is not enough, it will bring inconvenience to the test work

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