Force measuring structure used for testing solderability

Abstract

The invention discloses a force measuring structure used for testing solderability. The force measuring structure comprises a balance mechanism, and a rotating shaft of the balance mechanism is made of hard alloy. A first iron core and a second iron core are hung at the two ends of the balance mechanism correspondingly. The lower end of the first iron core is connected with a sample clamp, and displacement sensors are arranged on the side face of the first iron core. Electromagnetic coils are arranged on the side face of the second iron core. A balancing weight is further arranged at the end, where the first iron core is hung, of the balance mechanism. The force measuring structure further comprises a controller and an amplifying circuit. The displacement sensors are used for detecting displacement of the first iron core and transmitting displacement signals to the controller. The controller transmits received displacement sensor signals to a recording device through A / D conversion. Meanwhile, the received displacement sensor signals are converted into current output in a linear mode and the output current is transmitted to the amplifying circuit. The amplifying circuit amplifies the current passing through the amplifying circuit and transmits the current to the electromagnetic coils. By means of the force measuring structure used for testing solderability, the purpose of improving resetting sensitivity of a solderability tester force measuring system can be achieved.

Description

technical field [0001] The invention relates to the field of weldability testers, in particular to a force-measuring structure for testing weldability. Background technique [0002] Solderability test refers to the qualitative and quantitative evaluation of the solderability of components, PCB boards, PADs, solders and fluxes, etc. through the wetting balance method. Both level 1 (IC packaging) and level 2 (assembly of electronic components to printed circuit board) processes in the modern electronics industry require high-quality interconnection technology, as well as high-quality and zero-defect soldering processes. Solderability testing is generally used to make a qualitative and quantitative evaluation of the solderability of components, printed circuit boards, solder and flux, etc. In the assembly welding process of electronic products, the welding quality directly affects the quality of the whole machine. Therefore, in order to improve the welding quality, in additio...

AI Technical Summary

Problems solved by technology

However, the force measuring system of the existing solderability tester has a slow automatic reset speed and the sensitivity needs to be improved

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