Sound-absorbing structure of photosensitive resin material

Abstract

The invention discloses a sound-absorbing structure of a photosensitive resin material. The structure comprises wedges and a bottom plate. The wedges are distributed on one surface of the bottom plate in an array. The bottom plate and the wedges are integrated formed by means of photosensitive resin through 3D printing. Through holes are formed in the bottom plate, wedge cavities are formed in the wedges, the wedge cavities correspond to the through holes, and the other surface of the bottom plate is provided with a micro-perforated panel. The compound sound-absorbing structure composed of the bottom plate and the wedges is adopted, the whole structure uses the impedance matching principle, the wedges are used for achieving effective transmission of low-frequency sound waves, and a base is used for effectively consuming the sound waves transmitting into the base. Besides, the micro-perforated panel on the bottom plate, the through holes in the bottom plate and the wedge cavities form a pipe cavity coupled resonance structure, the sound absorbing characteristic of pipe cavity coupled resonance is well used for consuming sound energy, and the sound absorbing effect is further improved.

Description

technical field [0001] The invention relates to a sound-absorbing structure of a photosensitive resin material, belonging to the technical field of noise control. Background technique [0002] There are many kinds of sound-absorbing materials and sound-absorbing structures used in noise control engineering, which can be roughly divided into porous sound-absorbing materials and resonant sound-absorbing materials according to their sound-absorbing principles. For example, aluminum foam and copper foam are porous sound-absorbing materials, while thin-plate resonance sound-absorbing structures, thin-film resonance sound-absorbing structures, and perforated plate resonance sound-absorbing materials are all resonant sound-absorbing materials. In recent years, the research on noise has continued to deepen, and the application of resonant sound-absorbing structures has expanded to a wider field. Although the resonant sound-absorbing structure of the perforated plate and the more po...

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Problems solved by technology

However, in terms of processing, silicon carbide has poor machinability and cannot meet the requirements of machining.

Moreover, the particle size of silicon carbide is also very important in sound absorption. If the particle size is too large, it will greatly affect its sound absorption performance and greatly reduce the sound absorption performance. Therefore, if you want to ensure better sound absorption performance, you must use fine silicon carbide The processing accuracy of "foamy" particles is difficult to achieve in the traditional processing industry, which is not conducive to the popularization and use of this structure. In addition, the disclosed sound-absorbing structure cannot fully utilize the sound-absorbing characteristics of lumen coupling resonance to consume sound energy

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