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Ultra-thin copper foil material

A technology of ultra-thin copper foil and copper foil, which is applied in the direction of metal pattern materials, printed circuit components, electrical components, etc., and can solve the problems of high price, insufficient adhesion between chemical copper and substrate, wrinkles and scratches, etc.

Pending Publication Date: 2016-12-07
SIHUI FUJI ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Directly use the ultra-thin copper foil provided by the supplier, because the copper foil is very thin, it will be easily wrinkled and scratched during lamination; and if the composite copper foil with copper foil is used, it is generally single-sided copper foil , need to increase the adhesive between the ultra-thin copper foil and the carrier foil, which will be subject to the high cost and high price of the copper foil supplier
[0004] Common copper foil is used for thinning treatment. Generally, 18um copper foil is used for thinning to less than 9um, which will cause problems such as difficult control of thickness, large copper foil roughness, and large copper loss.
[0005] The method of directly depositing chemical copper on the insulating substrate without ultra-thin copper foil will have the problem of difficult surface treatment of the insulating substrate, and the lack of adhesion between the chemical copper and the substrate is prone to layering and blistering

Method used

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Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0018] Specific implementation mode 1: ultra-thin copper foil copper clad laminate

[0019] Step A. First, assemble according to the normal production method of ordinary double-sided copper clad laminates. The size is 610mm*510mm. A piece of 2116 is used in the middle, the resin content is 53%, the thickness is 0.123mm, and a piece of 18um copper foil is placed on each side.

[0020] Step B. Vacuum lamination of the materials combined above, the lamination temperature is 110°C, the lamination time is 60 minutes, and the pressure is 35kg / cm 2 .

[0021] Step C. After lamination, seal the copper foil on both sides around the board with adhesive tape. The width of the adhesive tape is 15mm, and etch away the copper foil that is not covered by the adhesive tape.

[0022] Step D, tear off the tape, and directly carry out electroless copper deposition on the sheet, without removing the glue residue.

[0023] Step E, put the sheet into a vacuum laminator and perform lamination with...

specific Embodiment approach 2

[0025] Embodiment 2: Manufacture of resin-attached copper foil (RCC)

[0026] Step A, stacking, the material size is 610mm*510mm, three 18um copper foils and two 2116 prepregs are stacked, and the outermost copper foil faces the prepreg.

[0027] Step B. Vacuum lamination of the materials combined above, the lamination temperature is 110°C, the lamination time is 60 minutes, and the pressure is 35kg / cm 2 .

[0028] Step C. After lamination, seal the copper foil on both sides around the board with adhesive tape. The width of the adhesive tape is 15mm, and etch away the copper foil that is not covered by the adhesive tape.

[0029] Step D, tear off the tape, and directly carry out electroless copper deposition on the sheet, without removing the glue residue.

[0030] Step E, electroplating a layer of 1-9um copper layer on the board, or not electroplating.

[0031] Step F, tear the board from the middle, remove the middle layer of copper foil, and then become 2 sheets of resin...

specific Embodiment approach 3

[0032] Specific embodiment 3: used in the manufacture of laminated boards

[0033] According to the method of Embodiment 2, in step E, 1-3um copper is electroplated to manufacture resin-attached copper foil.

[0034] The resin-attached copper foil is vacuum-pressed on the board to be laminated according to the ordinary RCC method.

[0035] Laser drilling and blind hole copper plating are directly performed. Since the copper is very thin and uniform, there is no need to open a window for the laser hole or half-etch copper to thin it.

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Abstract

The invention discloses an ultra-thin copper foil material. A chemical copper layer is used as a base conductive layer, so that the ultra-thin copper foil is realized. According to the ultra-thin copper foil material, semi-cured resin and the chemical copper layer are subjected to a low-temperature lamination and high-temperature vacuum lamination method in a matching manner, so that the practicability of the process is realized, and firm combination between the chemical copper and the resin is ensured.

Description

technical field [0001] The invention relates to the field of PCB materials and manufacturing, in particular to a circuit board factory using its own materials and equipment to manufacture copper foil with a thickness of less than 9um and a method thereof. Background technique [0002] Ultra-thin copper foil is the basic material used for making ultra-thin lines (less than or equal to 2mil / 2mil line width and spacing) and laser drilling on circuit boards. It is easy to use ultra-thin copper foil to make ultra-thin lines by additive method. Ultra-thin Copper foil is easy to achieve laser direct ablation of copper layer. [0003] Directly use the ultra-thin copper foil provided by the supplier, because the copper foil is very thin, it will be easily wrinkled and scratched during lamination; and if the composite copper foil with copper foil is used, it is generally a single-sided copper foil , need to increase the adhesive between the ultra-thin copper foil and the carrier foil...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/09H05K3/02
CPCH05K1/09H05K3/022H05K2201/0355
Inventor 黄明安刘天明陈杰
Owner SIHUI FUJI ELECTRONICS TECH
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