A measuring device for thermal deformation and displacement of ion thruster grid assembly

Abstract

The invention relates to a measurement device for thermal deformation displacement of a gate electrode assembly of an ion thruster, wherein the measurement device belongs to the field of measurement technology. The measurement device mainly comprises the components of vacuum measurement equipment, a hanging rod, a fixing rod, an illuminating lamp, a high-resolution camera and an alumina lead pin. The tail of the alumina lead pin is fixedly connected with the screen gate electrode of a to-be-measured ion thruster, and the needle head extends out of a small hole of an acceleration gate electrode of the to-be-measured ion thruster. The high-resolution camera is utilized for performing photographing on the surface of the acceleration gate electrode of the to-be-measured ion thruster before and after operation. Then a picture is processed through image processing software, thereby obtaining the thermal deformation displacement of the gate electrode assembly of the to-be-measured ion thruster. The measurement device can perform real-time measurement on the thermal deformation displacement of the gate assembly of the ion thruster in a working state. Furthermore the measurement device improves reliability and safety in measurement.

Description

technical field [0001] The invention relates to a device for real-time measuring the thermal deformation displacement of a grid assembly under the working condition of an ion thruster, belonging to the technical field of measurement. Background technique [0002] When measuring the thermal deformation displacement of the ion thruster grid acceleration system, the traditional method is to stick the metal guide pin to the surface of the acceleration grid to measure the displacement when the ion thruster is not working. On the one hand, under the action of thermal deformation, the metal pins used in this method are likely to come into contact with the grid assembly to cause a short circuit, and the method of pasting will cause the metal pins to fall off. On the other hand, this method cannot perform real-time on-line measurement of thermal deformation and displacement during the working process of the ion thruster, so the measurement results lose the most important value; moreo...

AI Technical Summary

Problems solved by technology

On the one hand, under the action of thermal deformation, the metal lead pins used in this method are likely to come into contact with the grid components to cause a short circuit, and the method of pasting will cause the metal lead pins to fall off

On the other hand, this method cannot perform real-time on-line measurement of thermal deformation and displacement during the working process of the ion thruster, so the measurement results lose the most important value; moreover, due to the large thermal expansion coefficient of the metal material, the metal guide pin itself forms The thermal deformation caused a large error to the final measurement result

Images