Sensor module and manufacturing method thereof

A sensor module, sensor chip technology, applied in the field of sensors

Pending Publication Date: 2016-12-14
苏州科阳半导体有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, the present invention proposes a sensor module and its manufacturing method to solve the problems existing in the existing sensor module, improve the reliability of the sensor module, and reduce the difficulty of wiring

Method used

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  • Sensor module and manufacturing method thereof
  • Sensor module and manufacturing method thereof
  • Sensor module and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] figure 1 It is a schematic structural diagram of the sensor module provided by Embodiment 1 of the present invention. The sensor module provided by the embodiment of the present invention may include an image sensor module, a fingerprint sensor module or other products, and may be applied to electronic devices such as smart phones, tablet computers, digital cameras, car driving recorders, attendance machines, and access control devices. The present invention is not limited thereto.

[0062] Such as figure 1 As shown, the sensor module provided in this embodiment includes:

[0063] The sensor chip 110 and at least one first auxiliary chip 120, the sensor chip 110 and at least one first auxiliary chip 120 are packaged into a chip package 100 by the plastic encapsulation material 101, and the circuit faces of the sensor chip 110 and at least one first auxiliary chip 1220 face the same direction;

[0064] Wherein, the sensor chip 110 includes a sensing unit 111, the sen...

Embodiment 2

[0071] figure 2 It is a schematic structural diagram of the sensor module provided by Embodiment 2 of the present invention. Such as figure 2 As shown, further, the sensor chip is an image sensing chip 110, the image sensing chip 110 includes an image sensing unit 111, and a packaging glass 115 arranged above the light incident surface of the image sensing unit 111, and the front side of the chip package 100 is formed The light through hole 103 corresponding to the packaging glass 115, the back edge of the image sensing unit 111 is formed with a groove structure 112, and the image sensing unit 111 includes a welding pad opposite to the groove structure 111;

[0072] The sensor module also includes:

[0073] The lens holder 130 is installed on the front of the chip package 100, and the lens group 140 is fixed on the lens holder 130, and the lens group 140 includes at least one optical film.

[0074] Optionally, the molding material 101 covers the edge of the light incident...

Embodiment 3

[0081] image 3 It is a schematic structural diagram of the sensor module provided by Embodiment 3 of the present invention. Such as image 3 As shown, further, the sensor chip is a fingerprint sensor chip 110, the fingerprint sensor chip 110 includes a fingerprint sensor unit 111, on the front of the chip package 100, the plastic packaging material 101 at least partially covers the working surface of the fingerprint sensor chip 110.

[0082] Optionally, the front surface of the chip package 100 is further provided with a color coating and / or a wear-resistant coating 130 .

[0083] Optionally, a protruding limiting ring 140 is provided on the front edge of the chip package 100 , and the area defined by the limiting ring 140 corresponds to the working surface of the fingerprint sensor chip 110 .

[0084] The sensor module provided in this embodiment also includes a rigid-flex board 150, wherein the rigid-flex board 150 includes a conductive circuit layer, and a plurality of w...

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PUM

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Abstract

The embodiment of the invention discloses a sensor module, which comprises a sensor chip and at least one first auxiliary chip, wherein the sensor chip and at least one first auxiliary chip are packaged into a chip packaging body by use of a plastic packaging material; the sensor chip comprises a sensing unit; a groove structure is formed in the edge of the back surface of the sensing unit; at least one first through hole is formed in the bottom of the groove structure and leads out a bonding pad through a metal layer to form a welding pad of the sensor chip; the metal layer extends to the back surface of the sensing unit along the groove structure from the first through hole; the groove structure is filled with the plastic packaging material and is connected with the plastic packaging material at the outer side of the sensor chip into a whole; a rerouting pattern is formed on the back surface of the chip packaging body and is electrically connected with the welding pad of the sensor chip and the welding pad of the at least one first auxiliary chip; and a plurality of salient points are also formed on the rerouting pattern. By the sensor module, the mechanical reliability of the sensor module is improved.

Description

technical field [0001] The invention relates to the field of sensors, in particular to a sensor module and a manufacturing method thereof. Background technique [0002] Sensor chips include image sensor chips and fingerprint sensor chips, etc., which can sense the measured information and convert the sensed information into electrical signals or other required forms of information output according to certain rules to meet the requirements of information transmission and processing. , storage, display, recording and control requirements. After the sensor chip is manufactured, a series of packaging processes are first performed on the sensor chip, and then different types of sensor chips are assembled to form a sensor module. [0003] The existing sensor chip packaging method is mainly COB (Chip On Board) packaging, the bare chip is attached to the interconnection substrate with conductive or non-conductive adhesive, and then wire bonding is performed to realize its electrica...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/146H01L23/04H01L21/70H01L21/768
CPCH01L27/146H01L27/14601H01L27/14625H01L27/14636H01L27/14683H01L21/70H01L21/76838H01L23/04
Inventor 朱文辉吕军王邦旭赖芳奇
Owner 苏州科阳半导体有限公司
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