A miniaturized equalizer based on lcp technology

An equalizer and process technology, applied in the field of power devices, can solve the problems of low dielectric constant and large size of the substrate, and achieve the effect of size reduction, size reduction and small volume

Inactive Publication Date: 2017-11-10
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the most commonly used equalizer is a microstrip equalizer, and the dielectric constant of the substrate used in the low frequency band is low, which makes the size of the microstrip equalizer in the low frequency band relatively large.

Method used

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  • A miniaturized equalizer based on lcp technology
  • A miniaturized equalizer based on lcp technology
  • A miniaturized equalizer based on lcp technology

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Embodiment Construction

[0021] The present invention will be further described below in conjunction with accompanying drawing and specific embodiment:

[0022] Such as Figure 1-3 As shown, the structure diagram of the miniaturized equalizer based on the LCP process of the present invention has seven layers in total, including the metal ground layer 0, the first dielectric layer 1, the first metal layer 2, and the second dielectric layer stacked sequentially from bottom to top. Layer 3, second metal layer 4, third dielectric layer 5 and third metal layer 6. The first dielectric layer 1, the second dielectric layer 3, and the third dielectric layer 5 are all made of LCP and are provided with metallized through holes. The metal ground layer 0 , the first metal layer 2 , the second metal layer 4 and the third metal layer 6 are printed on the surface of the dielectric layer and form three LCP resonators together with the metallized through holes. The surface microstrip of the resonator is connected to ...

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Abstract

The invention discloses a miniaturized equalizer based on LCP technology, which comprises a metal ground layer, a first dielectric layer, a first metal layer, a second dielectric layer, a second metal layer and a third dielectric layer sequentially stacked from bottom to top layer and the third metal layer, the first dielectric layer, the second dielectric layer, and the third dielectric layer are all made of LCP and are provided with metallized through holes, the metal ground layer, the first metal layer, the second metal layer layer and the third metal layer are printed on the surface of the dielectric layer, and form three LCP resonators with metallized through holes, and the resonators are connected by an equivalent structure of a microstrip line. The invention has the advantages of small size, large equalization amount and small insertion loss, and is especially suitable for adjusting the power gain flatness of high-power traveling wave tubes working in the low frequency band.

Description

technical field [0001] The invention belongs to the technical field of power devices, and in particular relates to a miniaturized equalizer based on an LCP process. Background technique [0002] The gain equalizer is used to solve the problem of uneven gain of the traveling wave tube amplifier. A better equalization effect is the prerequisite for the SSA to provide suitable driving power for the TWT, and it is also the guarantee for the good overall performance of the MPM. Gain equalizers are divided into microstrip type, waveguide type and coaxial type according to the transmission medium. Microstrip gain equalizer is composed of microstrip circuit, planar structure, light weight, small size, easy to integrate with solid-state circuit. This type of microwave gain equalizer can use microwave circuit simulation technology to carry out accurate and fast simulation, which greatly improves the design efficiency of the circuit and has high stability. [0003] Liquid crystal pol...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01J23/18H01P5/00
CPCH01J23/18H01J2223/18H01P5/00
Inventor 夏雷翟思江栋一郎小元延波徐锐敏
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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