A miniaturized equalizer based on lcp technology
An equalizer and process technology, applied in the field of power devices, can solve the problems of low dielectric constant and large size of the substrate, and achieve the effect of size reduction, size reduction and small volume
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[0021] The present invention will be further described below in conjunction with accompanying drawing and specific embodiment:
[0022] Such as Figure 1-3 As shown, the structure diagram of the miniaturized equalizer based on the LCP process of the present invention has seven layers in total, including the metal ground layer 0, the first dielectric layer 1, the first metal layer 2, and the second dielectric layer stacked sequentially from bottom to top. Layer 3, second metal layer 4, third dielectric layer 5 and third metal layer 6. The first dielectric layer 1, the second dielectric layer 3, and the third dielectric layer 5 are all made of LCP and are provided with metallized through holes. The metal ground layer 0 , the first metal layer 2 , the second metal layer 4 and the third metal layer 6 are printed on the surface of the dielectric layer and form three LCP resonators together with the metallized through holes. The surface microstrip of the resonator is connected to ...
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