Water liquid circulating felt wetting device for BGA (ball grid array) substrate cleaning device

Abstract

The invention discloses a water liquid circulating felt wetting device for a BGA (ball grid array) substrate cleaning device. The water liquid circulating felt wetting device comprises a frame, a water pipe is fixed to the bottom of the middle of a top plate of the frame, the lower end of the water pips is fixed to the top of a lower connecting portion, an inner filter cavity is formed in the lower connecting portion, the bottom of the lower connecting portion is provided with a mounting groove, a felt block is fixedly nested in the mounting groove, the top of the mounting groove is provided with a middle transition through groove communicated with the inner filter cavity, the side wall of the water pipe is communicated with a plurality of branch water pipes, and the branch water pipes are communicated with the inner filter cavity. Water liquid is distributed by the water pipe and the branch water pipes and repeatedly filtered by a filter sponge, a porous plate and a sponge layer, the impact force of the water liquid is greatly reduced, so that the wetted felt block cannot be impacted and is good in wetting effect, subsequent wetting of a BGA substrate is facilitated, the water liquid after wetting is filtered and can be recycled, and the use rate of the water liquid is increased.

Description

[0001] Technical field: [0002] The invention relates to the technical field of cleaning processing equipment, and more specifically relates to a water-liquid circulating felt wetting device for a BGA substrate cleaning device. [0003] Background technique: [0004] BGA high-density devices are made of spherical contacts as pins in an array on the bottom of the substrate, which has the advantages of short pins, small lead inductance and capacitance; large center distance of solder joints, high assembly yield; firm pins and good coplanarity And other advantages, has been widely used in the field of ultra-high density and ultra-miniature electronic products. [0005] However, the more obvious defect of the BGA substrate is that it is difficult to clean after assembly. In the existing mechanical cleaning device, automatic water spray and brush roller are used for rolling cleaning, and the BGA substrate needs to be wetted before the water spray, so that the surface Impurities ar...

AI Technical Summary

Problems solved by technology

[0005] However, the more obvious defect of the BGA substrate is that it is difficult to clean after assembly. In the existing mechanical cleaning device, automatic water spray and brush roller are used for rolling cleaning, and the BGA substrate needs to be wetted before the water spray, so that the surface Impurities are easily washed away, and then sprayed with water, and the current wet felt generally uses water to impact the felt layer, so that the substrate is wet after the felt is wet, and the direct impact of the water on the felt layer is easy to make the plush on the felt, etc. Blowing off will affect the wetting effect. At the same time, the existing wet water is generally discharged directly after use and cannot be reused, which greatly reduces the utilization rate of water and has no water-saving and energy-saving effect.

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