Coating method, etching method and coating equipment for metal strip for etching
What is Al technical title?
Al technical title is built by PatSnap Al team. It summarizes the technical point description of the patent document.
A metal strip and etching technology, applied in the field of etching, can solve the problems of high cost, security threats, and high labor costs, and achieve the effects of compressing processing cycles, saving labor, and improving reliability.
Active Publication Date: 2019-02-05
深圳臻金精密科技有限公司
View PDF3 Cites 0 Cited by
Summary
Abstract
Description
Claims
Application Information
AI Technical Summary
This helps you quickly interpret patents by identifying the three key elements:
Problems solved by technology
Method used
Benefits of technology
Problems solved by technology
[0023] The purpose of the present invention is to provide a coating method, etching method and equipment for metal strips used for etching, aiming at solving the problems of high cost, safety threats, High labor costs and other issues
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more
Image
Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
Click on the blue label to locate the original text in one second.
Reading with bidirectional positioning of images and text.
Smart Image
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0045] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0046] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or there may be an intervening element at the same time. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present.
[0047] It should also be noted that the orientation terms such as left, right, up, and down in this embodiment are only relative concepts or refer to the normal use state of the product, and should not be regarded as limiti...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more
PUM
Login to view more
Abstract
The invention relates to an etching technology and provides a film covering method of metal strip for etching, an etching method and film covering equipment. The film covering method comprises steps of film covering, first die cutting, first demoulding, second film covering, second die cutting, third film covering, fourth film covering and second demoulding. The film covering equipment comprises a first film covering device, a first die cutting device, a first demoulding device, a second film covering device, a second die cutting device, a third film covering device, a fourth film covering device and a second demoulding device sequentially arranged and enabling metal strip to continuously move. According to the invention, the following steps are finished in sequence: the metal strip is coated with an adhesive film, the adhesive film on an etching area of the metal strip can be mechanically removed, a non-etching area is protected, and the etching area is in direct contact with etching liquid, so that labor force is saved, the processing cycle is shortened, proportion of a chemical reagent is reduced, requirements for the environment and the raw material are lowered, reliability of the non-etching area is improved, and the production efficiency is greatly improved.
Description
technical field [0001] The present invention relates to etching technology, more specifically, relates to a method for coating a metal strip used for etching, an etching method and coating equipment. Background technique [0002] Etching, also known as photochemical etching, refers to removing the protective film of the area to be etched after exposure plate making and development, and contacting chemical solutions during etching to achieve the effect of dissolution and corrosion, forming concave-convex or hollow-out molding effects. Etching can be used to make printing concave-convex plates such as copper plates and zinc plates at the earliest, and is widely used in the processing of weight-reducing instrument panels, nameplates, and thin workpieces that are difficult to process by traditional processing methods; after continuous improvement and development of process equipment, it can also be used It is used in the processing of precision etching products of thin electroni...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more
Application Information
Patent Timeline
Application Date:The date an application was filed.
Publication Date:The date a patent or application was officially published.
First Publication Date:The earliest publication date of a patent with the same application number.
Issue Date:Publication date of the patent grant document.
PCT Entry Date:The Entry date of PCT National Phase.
Estimated Expiry Date:The statutory expiry date of a patent right according to the Patent Law, and it is the longest term of protection that the patent right can achieve without the termination of the patent right due to other reasons(Term extension factor has been taken into account ).
Invalid Date:Actual expiry date is based on effective date or publication date of legal transaction data of invalid patent.
Login to view more 
Login to view more