Sensing array capable of implementing high-accuracy synchronous measurement of three-dimensional deformation and three-dimensional pressure

A high-precision synchronous sensor array technology, applied in the direction of electric/magnetic solid deformation measurement, force measurement, and measurement devices, can solve the problems of low measurement accuracy, insufficient compact structure, and low spatial resolution, and achieve high measurement sensitivity , compact structure, and the effect of improving spatial resolution

CN106289594AInactive Publication Date: 2017-01-04JILIN UNIV
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
Publication Date
2017-01-04
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to a sensing array capable of implementing high-accuracy synchronous measurement of three-dimensional deformation and three-dimensional pressure, and belongs to a sensing array for high-accuracy three-dimensional parameter measurement. The sensing array comprises a lower flexible circuit board, a lower elastic polymer substrate with grooves, an array of capacitance units and elastic piezoresistance units arranged in the grooves, an upper elastic polymer substrate and an upper flexible circuit board, wherein the capacitance units and the elastic piezoresistance units are integrated into a reticular sensing array structure; each capacitance unit is adjacent to six elastic piezoresistance units. According to the sensing array, synchronous measurement of the three-dimensional pressure and the three-dimensional deformation of an interface can be implemented; the magnitude of the pressure is measured by the capacitance units, the spatial direction of the pressure is determined by the elastic piezoresistance units, and high-accuracy measurement of the three-dimensional pressure can be implemented; the sensing array can be applied to parameter measurement of an interface such as a seat and an insole, and more accurate and complete parameter indexes can be provided for the field of ergonomics.
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Description

technical field

[0001] The invention relates to a sensor array for high-precision measurement of three-dimensional parameters, in particular to a sensor array capable of realizing high-precision simultaneous measurement of three-dimensional deformation and three-dimensional pressure. Background technique

[0002] The three-dimensional pressure and three-dimensional deformation of the interface provide important parameter indicators in the field of ergonomics, and provide references for the design, improvement and evaluation of seats, insoles and other products. For people who have been sitting or lying down for a long time, such as office workers, long-distance bus drivers, hemiplegia or bedridden patients, if the human body is kept in an unreasonable state of pressure for a long time, it will lead to serious diseases. Therefore, it is of great research significance to accurately measure the three-dimensional pressure and three-dimensional deformation of the interface. [0...

Examples

Embodiment Construction

[0039] The sensor array (the overall size of the sensor array structure is consistent with the seat interface) that can realize three-dimensional deformation and three-dimensional pressure simultaneous measurement with high precision will be described as an example below.

[0040] It includes a lower flexible circuit board 6, a lower elastic polymer substrate 5 with grooves, an array of capacitor units 4 and elastic piezoresistive units 3 arranged in the grooves, an upper elastic polymer substrate 2, and an upper flexible circuit board 1; The unit 4 and the elastic piezoresistive unit 3 are integrated into a mesh sensing array structure, wherein each capacitive unit 4 is adjacent to six elastic piezoresistive units 3 .

[0041] The central contact electrodes 601 and peripheral contact electrodes 602 on the lower flexible circuit board 6 according to the present invention are in the shape of convex cylinders, and each central contact electrode 601 and six adjacent peripheral con...