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Fingerprint imaging module group and manufacturing method thereof

A manufacturing method and imaging module technology, which are applied in the directions of acquiring/organizing fingerprints/palmprints, printing image collection, character and pattern recognition, etc., can solve the problems of low light transmittance of fingerprint imaging modules, and achieve improved imaging effect, Improve the effect of coloring and increase the light transmittance

Inactive Publication Date: 2017-01-04
SHANGHAI OXI TECH
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  • Summary
  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, the fingerprint imaging module formed by the existing technology has the problem of low light transmittance

Method used

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  • Fingerprint imaging module group and manufacturing method thereof
  • Fingerprint imaging module group and manufacturing method thereof
  • Fingerprint imaging module group and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0041] It can be seen from the background art that the fingerprint imaging module formed in the prior art has the problem of low light transmittance. The reason for the low light transmittance problem is analyzed by combining the existing technology in the process of coating the color on the fingerprint imaging module:

[0042] In the prior art, the screen printing process is usually used to coat ink on the fingerprint imaging module to realize the coloring of the fingerprint imaging module.

[0043] refer to Figure 4 and Figure 5 , showing a schematic diagram of the existing screen printing, where, Figure 5 yes Figure 4 sectional schematic diagram.

[0044] The screen plate is composed of a screen frame 41 and a screen 42 . The screen is overlaid on the printed object 40 . During the screen printing process, the ink 43 is poured on the screen 42 , and since there is a certain gap between the screen 42 and the object 40 to be printed, the ink 43 will not directly con...

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Abstract

The invention relates to a fingerprint imaging module group and a manufacturing method thereof. The method comprises that an image sensor is provided; a coloring layer is formed on the image sensor; and the coloring layer is patterned to form a coloring pattern layer, and the coloring pattern layer comprises openings out of which the image sensor is exposed. According to the invention, the coloring pattern layer arranged on the image sensor is used to color the fingerprint imaging module group, and the coloring pattern layer comprises the openings out of the which the image sensor is exposed. The reflection light reflected by fingers can directly pass the openings, the transmittance of the reflection light is improved, and the imaging effect of the optical fingerprint imaging module group is improved; and the reflection light is directly projected onto the sensor via the openings needless of passing the coloring pattern layer, and thus, the thickness of the coloring pattern layer can be increased to improve the coloring effect of the fingerprint image module group.

Description

technical field [0001] The invention relates to the field of fingerprint imaging, in particular to a fingerprint imaging module and a manufacturing method thereof. Background technique [0002] Fingerprint identification technology collects the fingerprint image of the human body through the fingerprint sensor, and then compares it with the existing fingerprint imaging information in the fingerprint identification system to realize identity identification. Due to the convenience of use and the uniqueness of human fingerprints, fingerprint recognition technology has been widely used in various fields, such as: public security bureaus, customs and other security inspection fields, building access control systems, and consumer products such as personal computers and mobile phones, etc. [0003] refer to figure 1 combined reference figure 2 ,in figure 1 It shows a schematic diagram of the assembly of an optical fingerprint imaging module on a mobile phone in the prior art, ...

Claims

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Application Information

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IPC IPC(8): G06K9/00
CPCG06V40/1318
Inventor 房伟朱虹
Owner SHANGHAI OXI TECH
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