Real-time visualization experimental device and experimental method of the relationship between thermal resistance and heat conduction speed

Abstract

The invention relates to a real-time visualization experimental device of a thermal resistance and thermal conductivity speed relation. A base is provided with a transparent water tank. The front side wall and back side wall of the middle part of the length direction of the water tank are provided with a heat conduction plate which divides the water tank into a left water tank and a right water tank. The external base of the back side wall of the water tank is provided with a light screen. The outer base of the front side wall is provided with a laser bracket which is provided with an upper semiconductor laser, a middle semiconductor laser and a lower semiconductor laser. The three semiconductor lasers output three laser beams which pass a position close to the left side face of the heat conduction plate in the left water tank and is parallel to the side face and a horizontal plane. The axes of the three laser beams outputted by the three semiconductor lasers are in the horizontal center planes of an upper step plate, a middle step plate and a lower step plate, the three laser beams which go through the front and back side walls of the water tank are projected to the light screen, and three light points with the same distance are formed on a same vertical line.

Description

technical field [0001] The invention belongs to the technical field of thermal experiment instruments, and in particular relates to an experimental device for heat transfer. Background technique [0002] The heat transfer rate of an object is determined by two factors, one is the temperature difference and the other is thermal resistance. In the case of the same material and the same heat conduction length, that is, the same thermal resistance, the larger the temperature difference, the faster the heat conduction speed; The thickness of the layer is the principle of enhancing the thermal insulation effect. Due to the invisibility of the heat conduction process of objects, the understanding of the relationship between temperature difference, thermal resistance and heat conduction speed is usually compared with resistance, voltage, current and the relationship between them in the teaching process of heat transfer. Restricted by voltage and resistance, this simple analogy oft...

AI Technical Summary

Problems solved by technology

Due to the invisibility of the heat conduction process of objects, the understanding of the relationship between temperature difference, thermal resistance and heat conduction speed is usually compared with resistance, voltage, current and the relationship between them in the teaching process of heat transfer. Restricted by voltage and resistance, this simple analogy often causes students to misunderstand the physical nature of the two

The relationship between thermal resistance and heat conduction speed is one of the basic issues in heat transfer. Realizing the real-time visualization and dynamic display of the relationship between thermal resistance and heat conduction speed can not only make the traditional theoretical teaching more vivid, but also more likely to stimulate students' interest in learning , students' observation, analysis and thinking ability are cultivated in classroom interaction, which is an effective means to improve the teaching effect of heat transfer. In the teaching of heat transfer, there is no such experimental teaching demonstration instrument.

Images