Automatic skew detection silicon chip series welding feeding device

Abstract

The invention provides an automatic skew detection silicon chip series welding feeding device which comprises a support frame, a horizontal moving guiderail fixed at the top end of the support frame, a horizontal position adjustment motor installed at the end part of the horizontal moving guiderail, a slide platform installed on the horizontal moving guiderail and moving in the horizontal direction, a vertical moving guiderail fixed on the slide platform, a vertical position adjustment motor installed at the rear end of the vertical moving guiderail, a cylinder installed on the vertical moving guiderail and moving along the vertical moving guiderail vertically, a grip support plate installed at an expansion end of the cylinder, an angle position adjustment motor installed on the support plate, and a negative pressure retraction grip connected on an output shaft of the angle position adjustment motor in a sleeving manner, and the output shaft of the angle position adjustment motor faces downwards. The automatic skew detection silicon chip series welding feeding device automatically feeds a silicon chip and automatically rectifies the position, the adjustment and correction of the silicon chip in the horizontal, vertical and angular positions of a horizontal plane is implemented through three axes association in the moving process of the silicon chip, and the accuracy is greatly improved.

Description

technical field [0001] The invention relates to a feeding device, in particular to a silicon wafer serial welding feeding device capable of automatic deviation correction. Background technique [0002] During the silicon wafer welding production process of solar photovoltaic modules, the silicon wafers in the charging box need to be transported to the string welding workbench one by one, and then welded with the interconnection bars. In order to improve the production efficiency and accuracy of the automatic welding of silicon wafers, the feeding process of silicon wafers needs to be automated, and the position of the silicon wafers needs to be corrected before being put on the stage, so that when the subsequent silicon wafers are welded, the interconnection strips and the silicon wafers to be welded coincide. [0003] In the prior art, Chinese patent ZL 201110176757.2 discloses "an automatic deviation correction device for silicon wafers". The silicon wafer position fine-t...

AI Technical Summary

Problems solved by technology

The device adjusts the horizontal and vertical positions of the silicon wafer on the deviation correction plate by adjusting the position of the deviation correction plate, but the deviation correction device cannot accurately adjust the angle of the silicon wafer, and the structure is too complicated and the operation steps are too cumbersome

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