Active cooling device for mobile phone chip

Abstract

The invention discloses a mobile phone chip active heat dissipation device which comprises two multi-stage Knudsen compressors one of which is a main multi-stage Knudsen compressor and the other one of which is a auxiliary multi-stage Knudsen compressor; an evaporation chamber in which a refrigerant is stored and the air inlet of which is connected with the main multi-stage Knudsen compressor; a converging chamber connected with the air outlet of the evaporation chamber; a condensing chamber including a heat flow chamber connected to the converging chamber and a cold flow chamber connected with the auxiliary multi-stage Knudsen compressor; a descending channel connected to the heat flow chamber; a spiral channel connected with the descending channel; a gas-liquid separation chamber connected to the spiral channel and the upper end of which is covered with a hydrophobic flat film; an exhaust passage connected to the outlet of the cold flow chamber and the upper end of the gas-liquid separation chamber; and a liquid return channel via which the lower end of the spiral channel is connected with the liquid inlet of the evaporation chamber. The mobile phone chip active heat dissipation device realizes the integration of the heat dissipation device and the chip, and can realize the active heat dissipation, and has a good heat dissipation effect and a self-regulating ability.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of electronic devices, in particular to an active heat dissipation device for mobile phone chips. Background technique [0002] With the continuous advancement of technology, mobile phones are becoming more and more intelligent and multi-functional; the number of cores of mobile phone chips continues to increase, and the main frequency is also getting higher and higher. Since mobile phone chips need to perform complex calculations in a very short period of time, their power per unit area is very large. After a general smartphone has been running for a long time, the chip will emit a lot of heat. If this heat is not removed in time, it will cause the performance of the mobile phone to decrease due to the increase in temperature, and it will also increase the power consumption. At present, commonly used mobile phone cooling technologies include metal back cover composite graphite cooling,...

AI Technical Summary

Problems solved by technology

If this heat is not removed in time, it will cause the performance of the phone to drop due to the increase in temperature, and it will also increase power consumption

At present, commonly used mobile phone cooling technologies include metal back cover composite graphite cooling, ice nest cooling, thermal gel cooling, core cooling similar to frequency conversion technology, etc., but these technologies are passive cooling, the cooling effect is not very ideal, and it is difficult to meet the development of mobile phones. needs

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