Four-drive two-face chip polishing machine

Abstract

The invention relates to a four-drive two-face chip polishing machine. The four-drive two-face chip polishing machine is formed by a lower polishing device and an upper polishing device; a pressure disc and an upper polishing disc are installed below an air cylinder of the upper polishing device through rotation connectors, and a linkage hole is machined in the middle of the pressure disc; a first transmission column is installed on an outer rotary disc of the lower polishing device, a lower polishing disc is installed on a lower tray, a second transmission column is installed on an inner rotary disc, and a connector is installed on a linkage shaft; and the first transmission column, the lower polishing disc, the second transmission column and the connector are driven by a first motor, a second motor, a third motor and a fourth motor correspondingly; the pressure disc is driven by the connector on the linkage shaft, a chip containing hole is machined in a chip positioning liner, the chip positioning liner is placed on the lower polishing disc, and side teeth of the chip positioning liner are combined with the first transmission column and the second transmission column in a clamped manner. By means of the technology, the first transmission column and the second transmission column drive the chip positioning liner to rotate between the upper polishing disc and the lower polishing disc in two directions, and chips are polished for the first time; and meanwhile, when the upper polishing disc and the lower polishing disc rotate, the chips are polished for the second time, work of polishing at the two times are overlapped, and therefore the polishing efficiency of the chips is increased in a multiplied manner.

Description

technical field [0001] The technology belongs to the technical field of wafer rough polishing equipment, and in particular relates to a four-drive double-sided wafer polisher. Background technique [0002] After the sapphire wafer is cut piece by piece from the ingot, there will be rough cutting marks on the cut surface, so the wafer needs to be ground and polished. In the prior art, the technology used for wafer polishing is the closest to the present invention is the patent "Dual-track Driven Wafer Grinding Machine" invented by our company, patent application number: CN201520936550.4, the dual-track driven wafer grinding machine The support frame of the machine is equipped with a fixed disc, the upper surface of the fixed disc is installed with a circular lower grinding disc, the center of the fixed disc is installed with a central rotating shaft, the lower part of the central rotating shaft is connected to the central drive motor through a transmission gear, and the upper...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a four-drive double-sided wafer grinder, which solves the problems in the prior art that the design of the dual-track drive wafer grinder is not perfect and the production efficiency has not been fully utilized.

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