Die punching device for directly punching cavity and chain hole in carrier band

Abstract

The invention relates to a die punching device for directly punching a cavity and a chain hole in a carrier band. The die punching device comprises a die punching base, a middle plate, an upper punch, a guide sleeve and a guide column, the middle plate is mounted on the die punching base, the upper punch is mounted on the middle plate, the guide sleeve is mounted at two side ends of the upper punch, 2 rows of upper embedding plates and punching pins are arranged on the top surface of the upper punch at intervals, 15 rows of lower embedding plates are inserted into the base, forming bosses are uniformly arranged at the ends of the upper embedding plates at intervals, and grooves corresponding to the forming bosses are uniformly formed in the ends of the lower embedding plates at intervals. The sizes of the forming bosses and the grooves are changed, the size of the cavity can be adjusted, high-accuracy cavity is produced, the chain hole punching pins are arranged on the outer sides of the upper embedding plates, the chain hole is punched on the outer side of the cavity by the punching pins when the cavity is formed, the cavity and the chain hole are formed once, additional machining processes are omitted, the die punching device is convenient to operate, and production efficiency is improved.

Description

technical field [0001] The invention relates to a die device for directly punching out a cavity and a chain hole on a carrier tape. Background technique [0002] Carrier tape is a continuous strip product used in the field of electronic packaging. It has a specific thickness. Most of it is formed by integral extrusion molding of PS, ABS, PC plastic or other plastic materials. The length of the carrier tape is equal. Cavities for holding electronic components and chain holes for pulling the carrier tape are distributed at a distance. Sealing tape is pasted on the carrier tape to cover each cavity to prevent electronic components from falling out. During the insertion process in the factory, When electronic components are placed, the cover tape is peeled off, and the automatic placement equipment takes out the components contained in the pockets one by one, and pastes them on the integrated circuit board (PCB board). [0003] At present, with the development of the electronic...

AI Technical Summary

Problems solved by technology

[0003] At present, with the development of the electronic market, the chip tends to be smaller and smaller, and the cavity for holding electronic components on the carrier tape is also developing in the direction of precision, and its volume is also correspondingly smaller. Due to limited conditions, small It is difficult to produce the cavity, and in the molding process, after the cavity on the carrier tape is formed, the chain holes have to be processed through another process, which is time-consuming and laborious, and the production efficiency is low, which increases the production cost.

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