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AMOLED panel and manufacturing method therefor

A panel and substrate technology, which is applied in the field of AMOLED panel and the preparation of the AMOLED panel, can solve the problems of increased materials, rising cost, and inability to highlight the thin and light characteristics of the AMOLED panel, and achieves increased strength, enhanced bending resistance, and process saving. cost effect

Inactive Publication Date: 2017-01-11
EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method also cannot highlight the thin and light characteristics of the AMOLED panel, and additional materials are used, which increases the cost

Method used

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  • AMOLED panel and manufacturing method therefor
  • AMOLED panel and manufacturing method therefor
  • AMOLED panel and manufacturing method therefor

Examples

Experimental program
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Embodiment Construction

[0046] The AMOLED panel provided in the embodiment of the present invention includes a substrate glass 1 and a cover glass 2 . The substrate glass 1 is provided with an OLB area and an active matrix area. The OLB area is located on one side of the active matrix area. The cover glass 2 is fixedly arranged on the substrate glass 1 and completely covers the active matrix area. Therefore, in this embodiment The active matrix region is not marked in the corresponding drawings, but this is not a limitation of the present invention. Part of the cover glass 2 extends from the active matrix region to cover part of the OLB region (that is, part of the cover glass 2 extends from the active matrix region to the OLB region, and the extended part of the cover glass 2 covers part of the OLB region). For the convenience of illustration, the description of the active matrix region not included in the invention point will be omitted below, which is also not a limitation to the present invention...

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PUM

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Abstract

The invention relates to the manufacturing field of a semiconductor device, and particularly to an AMOLED panel and a manufacturing method therefor. A piece of cover board glass is reserved in a non-device region in an OLB region of the AMOLED panel so as to improve anti-bending capability of the OLB region under the premise that the thickness of the overall AMOLED panel is kept unchanged to further lower probability of corner-chipping fragments and the like of the device; and meanwhile, extra material usage is not required, and the technological cost is reduced.

Description

technical field [0001] The invention relates to the field of semiconductor device manufacturing, in particular to an AMOLED panel and a preparation method of the AMOLED panel. Background technique [0002] The display unit of the AMOLED (Active Matrix Organic Light Emitting Diode) panel is composed of substrate glass (LTPS TFT Glass) and cover glass (En cap Glass), where the AMOLED panel is at the OLB (outer lead welding area) end (substrate glass COG area, COG is the abbreviation of chip on glass, that is, the area where the chip is bound on the substrate glass) is a single glass plate. An active matrix area is provided on the substrate glass, and the cover glass completely covers the active matrix area, so the active matrix area completely covered by the cover glass is not marked in the corresponding figures below. Such as Figure 1a and Figure 1b As shown, because there is only one layer of substrate glass in the OLB area. When the thickness of the substrate glass is ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/32H01L51/52H01L51/56
Inventor 唐志舜
Owner EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD