Observation point and concurrence based fault injection simulation method and device

A fault injection and observation point technology, applied in electronic circuit testing, integrated circuit testing, etc., can solve problems such as long simulation time and single observation point, and achieve the effect of increasing simulation speed and reducing simulation time

Inactive Publication Date: 2017-02-08
HARBIN INST OF TECH
View PDF5 Cites 11 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the fault injection simulation method of the prior art using a single observation point and a single process, resulting in a shortcoming of too long simulation time, and propose a fault injection simulation method and device based on observation points and parallel

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Observation point and concurrence based fault injection simulation method and device
  • Observation point and concurrence based fault injection simulation method and device
  • Observation point and concurrence based fault injection simulation method and device

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0023] Specific implementation mode one: as figure 1 As shown, the fault injection simulation method based on observation points and parallelism in this embodiment includes:

[0024] Step 1: Obtain test data from the target circuit description code. The object code can be Verilog source code. In a specific embodiment, the test data may include description source code and test vectors of the target circuit.

[0025] Step 2: Using the obtained test data, analyze the hierarchical structure of the circuit, and obtain the signal paths of variables and network cable signals.

[0026] Step 3: Set fault injection parameters, which include fault injection location, fault injection type, fault injection time, fault injection times, monitoring signal and number of observation points; where the fault injection location can be in the circuit hierarchy Any position; fault injection types can include SEU (single event upset) and SET (single event transient pulse); fault injection time can...

specific Embodiment approach 2

[0030] Embodiment 2: The difference between this embodiment and Embodiment 1 is that in step 4, using a parallel method for fault injection includes using at least two VSIM processes at the same time, and the specific VSIM processes can be set according to the performance of the processor. Wherein the VSIM process is the main process in the simulation software Modelsim, and the present invention mainly uses the VSIM process.

[0031] Other steps and parameters are the same as those in Embodiment 1.

specific Embodiment approach 3

[0032] Embodiment 3: This embodiment differs from Embodiment 1 or Embodiment 2 in that the method of the present invention is used to evaluate the radiation resistance performance of integrated circuits. In aerospace and other fields, the integrated circuit structure is often very complex, and the simulation speed advantage of the fault injection simulation method of the present invention can be better reflected.

[0033] Other steps and parameters are the same as those in the first or second embodiment.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to an observation point and concurrence based fault injection simulation method and device, and belongs to the field of integrated circuit fault injection simulation methods. In order to solve a defect that a fault injection simulation method in the prior art is too long in simulation time because of adoption of a single observation point and a single process, the invention provides an observation point and concurrence based fault injection simulation method. The method comprises the steps of acquiring test data from description codes of a target circuit; setting fault injection parameters; setting a preset number of observation points in allusion to the test data, performing fault injection by adopting a concurrent mode, and generating an output file; detecting whether the target circuit operates normally or not at the next observation point after each period of fault injection, if so, performing the next period of injection, and if not, turning back to the previous observation point to start the next period of fault injection; and analyzing the output file to acquire a fault analysis result. The invention further comprises an observation point and concurrence based fault injection simulation device. The method and device provided by the invention can applicable to radiation resistance performance evaluation for integrated circuits.

Description

technical field [0001] The invention belongs to an integrated circuit fault injection simulation method, in particular to a fault injection simulation method and device based on observation points and parallelism. Background technique [0002] With the improvement of integrated circuit technology, integrated circuits are more and more sensitive to temperature changes, various radiation and electromagnetic interference; at the same time, with the wide application of integrated circuits in the aerospace field, the reliability of integrated circuits has gradually Performance is equally a concern. Most of the errors caused by radiation particles are caused by single event upset (Single Event Upset, SEU) and single event transient (Single Event Transient, SET). Fault injection can effectively evaluate the hardening effect of integrated circuits. [0003] In the prior art, common fault injection methods include ground accelerated irradiation experiments and fault injection in com...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28
CPCG01R31/287
Inventor 肖立伊李安龙赵强齐春华曹雪兵
Owner HARBIN INST OF TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products