Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Micro silicon microphone and manufacturing method thereof

A manufacturing method and microphone technology, which is applied to loudspeakers, electrostatic transducers, microphones, sensors, etc., can solve problems such as sensitivity interference and micro-silicon microphone stress effects, so as to improve sensitivity, suppress irregular stress, and ensure the quality of finished products Effect

Inactive Publication Date: 2017-02-15
MEMSENSING MICROSYST SUZHOU CHINA
View PDF4 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In view of this, the embodiment of the present invention provides a micro-silicon microphone and a micro-silicon microphone manufacturing method, which are used to solve the technical problem that the micro-silicon microphone is affected by stress and the sensitivity is disturbed.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Micro silicon microphone and manufacturing method thereof
  • Micro silicon microphone and manufacturing method thereof
  • Micro silicon microphone and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0039] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0040] The step numbers in the drawings are only used as reference signs for the steps and do not indicate the order of execution.

[0041] A method for manufacturing a microsilicon microphone according to an embodiment of the present invention mainly includes:

[0042] On the top of the silicon substrate, an insulating layer, a vibrating film layer, a sacrificial layer, a capacitor layer and a backplane structure layer are sequentially formed;

[00...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a micro silicon microphone and a manufacturing method thereof. And the microphone and the method are used for solving a technical problem that a micro silicon microphone stress influences sensitivity and a manufacturing technology. The micro silicon microphone comprises a vibrating membrane layer. The vibrating membrane layer comprises a vibration beam and a vibration membrane. The vibration beam is uniformly arranged around an edge of the vibration membrane. One end of the vibration beam is fixed to the edge of the vibration membrane and the other end of the vibration beam is fixed to a support structure.

Description

technical field [0001] The invention relates to a microphone and a manufacturing method, in particular to a miniature microphone and a manufacturing method. Background technique [0002] A microphone is a transducer that converts sound signals into electrical signals. Among them, the electret condenser microphone (ECM) has been widely used in various fields. However, the resident charge in the sensitive membrane of the traditional ECM will leak at high temperature, which will lead to the failure of the ECM. However, the automatic surface mount process of devices often needs to experience a soldering temperature as high as 260°C, which leads to the loss of ECM's advantages in the field of mass-automated production of consumer electronics. [0003] The micro-silicon microphone manufactured by micro-electromechanical system (MEMS) technology directly provides a bias voltage to the microphone through an external power supply, and does not need to store resident charges in the ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/04H04R31/00
CPCH04R19/04H04R31/00H04R2201/003
Inventor 孙恺胡维李刚
Owner MEMSENSING MICROSYST SUZHOU CHINA
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com