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plasma generator

A plasma and generating device technology, applied in the fields of plasma, semiconductor/solid-state device manufacturing, electrical components, etc.

Active Publication Date: 2019-05-21
WINTEL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In particular, when multiple helicon plasma modules are used to generate uniform plasma over a large area, the power distribution of the helicon plasma modules becomes a problem

Method used

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Embodiment Construction

[0030] In the deposition process of silicon oxide layers or silicon oxynitride layers etc. using multiple helicon wave plasma modules, high RF power shows better layer properties. Therefore, when the RF power of each helicon wave plasma module is above 1 kW, the helicon wave plasma modules are severely damaged by heat. A novel structure of the discharge vessel is needed to overcome this problem.

[0031] The helicon wave plasma generating apparatus according to an exemplary embodiment of the present disclosure performs plasma processing in a vacuum vessel at a low pressure of less than several hundred mTorr (mTorr). In addition, the helicon wave plasma generating device generates large-area plasma by combining a plurality of helicon wave plasma modules.

[0032] There is a need for a technique of forming a silicon oxynitride layer by nitrogen diffusion at a temperature below 300°C. High density (10 12 / cm 3 ) plasma generator for nitrogen diffusion. However, conventional in...

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Abstract

The present invention provides a plasma generation device and a helicon plasma module. The plasma generation device comprises: a plurality of helicon plasma modules for forming helicon plasma in an external magnetostatic field; and a main chamber for treating one substrate by receiving the plasma generated in the helicon plasma modules. Each of the helicon plasma modules comprises: an external container mounted so as to protude around a through hole formed on an upper plate of the main chamber, formed of a dielectric, and having a cylindrical shape; permanent magnets arranged at intervals in the center axis direction of the external container and forming a magnetostatic field in the center axis direction inside the external container; a cup-shaped internal container formed of a dielectric, having a predetermined gap from the external container, arranged inside the external container, and comprising an internal container upper plate; an induction coil arranged so as to wrap the external container; and an external container upper plate formed of a conductor, receiving a process gas from the outside, and mounted on the upper surface of the external container. The internal container upper plate comprises a plurality of through holes and has a gas buffer space formed between the internal container upper plate and the lower surface of the external container upper plate, wherein the process gas accumulated in the gas buffer space is provided to an inner space of the internal container through the through holes of the internal container upper plate so as to generate plasma.

Description

technical field [0001] The present disclosure relates to a helicon wave plasma generating device, and more particularly, to a plasma generating device using a plurality of helicon wave plasma modules and a double vessel structure. Background technique [0002] A helicon wave plasma device is disclosed in US 2008 / 024606 A1. The helicon wave plasma device can provide a higher plasma density than that provided by conventional inductively coupled plasma. In particular, when a large area of ​​uniform plasma is generated using a plurality of helicon wave plasma modules, power distribution of the helicon wave plasma modules becomes a problem. [0003] In order to overcome the above-mentioned problems, the inventors of the present disclosure filed Korean Patent Publication No. 10-2012-0000260A and Korean Patent Registration No. 10-1246191B1. The uniform power distribution unit can distribute uniform power to each helicon wave plasma module to provide large-area uniform plasma. C...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05H1/46H01L21/3065
Inventor 徐相勋郑成炫
Owner WINTEL
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