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Photocurable resin composition

A technology of photocurable resin and composition, which is applied in the field of photocurable resin composition, can solve the problems of long time consumption, cost becoming a problem, and limitation of fine pattern formation, etc., and achieve investment cost saving, excellent coating property, fast The effect of light curing

Active Publication Date: 2020-03-17
DONGJIN SEMICHEM CO LTD
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In conventional photolithography, which is used to realize fine patterns in the LCD process or semiconductor process for manufacturing displays, the circuit line width (or pattern line width) depends on the wavelength of light used in the exposure process. Material and equipment technology, fine pattern formation is subject to many restrictions
In addition, each time a pattern is formed, exposure, post-exposure bake, development, post-development bake, etching, and washing steps need to be performed, so there is a problem that it takes a long time and the process is very complicated.
In addition, an expensive exposure instrument is used to improve performance, so cost is also a problem

Method used

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  • Photocurable resin composition
  • Photocurable resin composition
  • Photocurable resin composition

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Experimental program
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Effect test

Embodiment 1 to 6 and comparative example 1、2

[0048] According to the composition of the following Table 1, each component was mixed, and it mixed uniformly at normal temperature for 6 hours or more, and the resin composition (unit: weight part) was manufactured.

[0049] At this time, the components used are as follows.

[0050] Acrylamide monomer: acryloyl morpholine (ACMO, Acryloyl morpholine, manufactured by Japan Kyojin Company) of chemical formula 1, dimethylacrylamide (DMAA, N, N-Dimethyl acrylamide, manufactured by Japanese Kyojin Company) of chemical formula 2, chemical formula 3 Diethylacrylamide (N,N-diethyl acrylamide) and chemical formula 4 dimethylaminoethyl acrylate (N,N-dimethylamino ethylacrylate);

[0051] Acrylic copolymer resin: (polyester acrylate (PS420, tetrafunctional polyester acrylate (Tetrafunctional Polyester acrylate), Korea Miwon Specialty Chemical Company);

[0052] Vinyl monomer: (glycidyl methacrylate (GMA, Glycidyl metaacrylate, Sigma-Aldrich);

[0053] Cross-linking monomers: pentaeryt...

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Abstract

The present invention relates to a photo-curable resin composition and, more particularly, to a photo-curable resin composition for forming micro patterns, the photo-curable resin composition being applicable to a flexible display substrate since the composition can be cured at high speed and has excellent coating properties, adhesive properties and acid resistance by virtue of comprising acrylamide monomer.

Description

technical field [0001] The present invention relates to a photocurable resin composition. More specifically, it relates to a photocurable resin composition that can achieve rapid curing and is excellent in applicability, adhesiveness, and acid resistance by including an acrylamide monomer. Background technique [0002] In the conventional photolithography method used to realize fine patterns in the LCD process or semiconductor process for manufacturing displays, the circuit line width (or pattern line width) depends on the wavelength of light used in the exposure process. There are many limitations in material and equipment technology and fine pattern formation. In addition, exposure, post-exposure bake, development, post-development bake, etching, washing steps, and the like need to be performed every time a pattern is formed. Therefore, there is a problem that it takes a long time and the process is very complicated. In addition, since an expensive exposure instrument and...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08F265/06C08F290/06C08F220/56
Inventor 宋晙溶申承协崔美镜智锡焕崔俊浩金龙宇
Owner DONGJIN SEMICHEM CO LTD
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