Cooling press with uniform cooling effect

Abstract

The invention discloses a cooling laminating press with uniform cooling effect. The cooling laminating press comprises a body and a plurality of heating units, wherein the body comprises a rack body and a plurality of cooling pressing plates. The cooling pressing plates are jointed with the rack body at vertical intervals, at least one cooling pressing plate is fixedly connected with the rack body, and other cooling pressing plates can be raised and lowered down relative to the cooling pressing plate fixedly connected with the rack body. The cooling pressing plates arranged at vertical intervals form a receiving chamber, and the plurality of heating units surround outside of the circumferential surface of the rack body. Each heating unit is provided with a plurality of heating members, and each heating member is provided with a heat outlet facing the corresponding receiving chamber. Due to the heating members, the temperature of the peripheral areas of each printed circuit board is the same with the temperature of other central areas, so that integral uniform cooling contraction and cooling effect can be generated.

Description

technical field [0001] The invention relates to a cooling pressing machine, in particular to a cooling pressing machine with a uniform cooling effect. Background technique [0002] A general printed circuit board (Print Circuit Board; PCB) is a pattern made by wiring circuit parts according to circuit design, and a circuit board made by surface treatment and machining. It is often used in digital cameras, notebook computers or other 3C Products, the existing printed circuit boards use glass fiber cloth as the base material, and at least one multi-layer board made of glass fiber cloth and copper foil is laminated on the surface of the base material. Stacking multiple layers, in the mass production process, after stacking multiple layers at a time and passing through the high-temperature pressing process, due to the difference in thermal expansion and cooling shrinkage rates between the copper foil and the glass fiber cloth, the multi-layer boards shrink non-uniformly, making ...

AI Technical Summary

Problems solved by technology

[0005] In order to solve the cooling process of the existing cooling press machine, due to the difference in cooling speed between the central area and the peripheral area of ​​each multilayer printed circuit board, the shrinkage of the peripheral area is greater than the shrinkage of the central area, resulting in multilayer printing. The circuit board is deformed and needs to be scrapped. The purpose of the present invention is to provide a cooling pressing machine with a uniform cooling effect. The present invention mainly arranges a plurality of heating units outside the ring side of the frame, and allows each heating unit to The hot air direction of each heating element is directed towards each accommodation chamber to control the peripheral temperature of each multilayer printed circuit board, so that the peripheral area and the central area can be cooled in a balanced manner, so that the entire multilayer printed circuit board can shrink evenly. And maintain the best shape, so as to improve the yield of each multilayer printed circuit board after the cooling and lamination process

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