Antenna feed integrated on multi-layer printed circuit board

A multi-layer printing and circuit board technology, applied in the field of antenna feeder, can solve the problems of uneasy integration of antenna and antenna feeder board, frequency bandwidth and efficiency loss, etc.

Active Publication Date: 2017-03-01
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, antenna and antenna feed board integration is not straight

Method used

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  • Antenna feed integrated on multi-layer printed circuit board
  • Antenna feed integrated on multi-layer printed circuit board
  • Antenna feed integrated on multi-layer printed circuit board

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Embodiment Construction

[0026] In this patent document, the following discussed Figure 1 to Figure 13 And the various embodiments used to describe the principles of the disclosure are by way of example only and should not be construed in any way to limit the scope of the disclosure. Those skilled in the art will understand that the principles of the present disclosure may be implemented in any suitably arranged wireless communication device.

[0027] figure 1 An exemplary wireless network 100 is shown in accordance with the present disclosure. figure 1 The implementation of wireless network 100 shown in is intended as an example only. Other implementations of wireless network 100 may be used without departing from the scope of this disclosure.

[0028] Such as figure 1 As shown, wireless network 100 includes eNodeB (eNB) 101 , eNB 102 and eNB 103 . eNB 101 communicates with eNB 102 and eNB 103 . The eNB 101 is also in communication with at least one Internet Protocol (IP) network 130, such as ...

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Abstract

The present disclosure relates to a pre-5th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4th-Generation (4G) communication system such as Long Term Evolution (LTE). A transmitter includes apparatus for integrating the antenna feed into a multilayer PCB. The apparatus includes an antenna element disposed over the multilayer PCB having slot openings that substantially overlap and that enable an RF signal to be coupled from a printed transmission line located on one of the multilayer PCB conductive layers. The multilayer PCB board hosts at least one transceiver unit and a baseband unit such that the antenna feed, transceiver and baseband units are integrated on a single multilayer PCB board without degradation of antenna bandwidth and efficiency.

Description

technical field [0001] The present application relates generally to wireless communication devices and, more particularly, to antenna feeds integrated on multilayer printed circuit boards. Background technique [0002] Efforts have been made to develop improved fifth generation (5G) or pre-5G communication systems in order to meet the demand for increased wireless data traffic due to the development of fourth generation (4G) communication systems. Therefore, the 5G or pre-5G communication system is also called "super 4G network" or "post-Long Term Evolution (LTE) system". [0003] 5G communication systems are considered to be implemented in higher frequency (millimeter wave) bands such as the 60GHz band in order to achieve higher data rates. In order to reduce the propagation loss of radio waves and increase the transmission distance, beamforming, massive multiple-input multiple-output (MIMO), full-dimensional MIMO (FD-MIDO), array antennas, analog beamforming, large scale...

Claims

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Application Information

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IPC IPC(8): H01Q1/24H01Q1/38
CPCH01Q9/0457H01Q9/20H01Q21/24H01Q23/00H01L2924/0002H05K1/0243H05K2201/0969H05K2201/10098H01L2924/00H01L23/66H01Q1/48H01Q1/50H01Q9/18
Inventor 伊奥安尼斯·扎尼蒂斯罗伯特·门罗
Owner SAMSUNG ELECTRONICS CO LTD
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