Double-surface ceramic plate polisher

Abstract

The invention discloses a double-surface ceramic plate polisher, and belongs to the field of polishing equipment. The double-surface ceramic plate polisher comprises a base, a movable platform, a polishing assembly, a workpiece placing table assembly and a controller, wherein the movable platform is mounted on the upper end surface of the base; the polishing assembly is mounted on the movable platform; the workpiece placing table assembly is mounted on the upper end surface of the base and corresponds to the polishing assembly; the workpiece placing table assembly comprises a first placing table, a first slide and a second placing table; a turnover part is positioned at an entrance of the first slide and is opposite to one side of the first placing table; a push rod mechanism is further arranged and corresponds to the first placing table; a pressure sensor is correspondingly arranged below workpiece placing positions of upper end surfaces of the first placing table and the second placing table; the controller is connected with the pressure sensor; and the controller controls a first moving mechanism, a second moving mechanism and a driving motor in a connection manner. The double-surface ceramic plate polisher is small in size, double surfaces of a ceramic plate can be polished, a working environment of experimental persons can be improved effectively, and experiment efficiency can also be improved.

Description

technical field [0001] The invention relates to the field of polishing equipment, in particular to a double-sided ceramic sheet polishing machine. Background technique [0002] At present, college laboratories often use manual polishing when trial-manufacturing ceramic samples. This processing method is easy to injure the fingers of the operator due to the thinner ceramic sheets (about 1-2mm). In addition, the grinding thickness of the ceramic sheet is not easy to control. If the surface is too thin, the surface processing quality will not be good, which will affect the performance test of the ceramic sheet. If the grinding is too thick, the ceramic sheet will be too thin and fragile. For the polishing of campuses and laboratories, small batches, and small workpieces, it would be wasteful to use an expensive CNC and high-efficiency polishing equipment, and it is not easy to carry. If ordinary manual polishing equipment is used, it is difficult to meet the polishing requirem...

AI Technical Summary

Problems solved by technology

[0002] At present, college laboratories often use manual polishing when trial-manufacturing ceramic samples. This processing method is easy to injure the fingers of the operator due to the thin ceramic sheets (about 1-2 mm)

In addition, the grinding thickness of the ceramic sheet is not easy to control. If the grinding is too thin, the surface processing quality will not affect the performance test of the ceramic sheet. If the grinding is too thick, the ceramic sheet is too thin and fragile.

For the polishing of campuses and laboratories on-the-go, small batches, and small workpieces, it would be particularly wasteful to use an expensive CNC and high-efficiency polishing equipment, and it is not easy to carry

If ordinary manual polishing equipment is used, it is difficult to meet the polishing requirements, and there are various safety hazards. Manual polishing may easily cause finger injuries to experimental operators, and the product qualification rate is low.

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