IGBT heat radiator

A radiator and water-cooled plate technology, which is applied in the direction of electric solid devices, semiconductor devices, semiconductor/solid device components, etc., can solve the problems of high energy consumption and large space occupation

Active Publication Date: 2017-03-08
株洲时代金属制造有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, this cooling method takes up a lot of space and consumes a lot of energy

Method used

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  • IGBT heat radiator
  • IGBT heat radiator
  • IGBT heat radiator

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Embodiment Construction

[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0032] The core of the present invention is to provide an IGBT radiator, which can reduce occupied space and reduce energy consumption during operation.

[0033] Please refer to Figure 2 to Figure 10 , figure 2 , image 3 and Figure 4 It is the front view, side view and top view of the specific embodiment of the IGBT heat sink provided by the present invention in sequence; Figure 5 and Figure 6 It is a front view and a top view of the internal water ...

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Abstract

The invention discloses an IGBT heat radiator, which comprises a water-cooled plate, a cooling fan and a plate fin-type heat radiator, wherein the front side of the water-cooled plate is matched with an IGBT module; the plate fin-type heat radiator is fixedly arranged on the back side of the water-cooled plate; the plate surface of the plate fin-type heat radiator is tightly fit with the back side of the water-cooled plate; the second interface of the water-cooled plate is communicated with the first interface of the plate fin-type heat radiator; the cooling fan is arranged at one side of the plate fin-type heat radiator; and a water pump is arranged between the first interface of the water-cooled plate and the second interface of the plate fin-type heat radiator. According to the IGBT heat radiator, through fit arrangement between the water-cooled plate and the plate fin-type heat radiator, heat generated by the IGBT module can be transmitted to the plate fin-type heat radiator through forced water cooling and heat conduction modes, in a condition with small heat radiation requirements, even without water circulation, the heat generated by the IGBT module can be transmitted to the plate fin-type heat radiator through the heat conduction mode, the heat transmission efficiency and the heat radiation efficiency are improved, the operation energy consumption is reduced, the structure is compact, and the occupied space is small.

Description

technical field [0001] The invention relates to the technical field of radiators, in particular to an IGBT radiator. Background technique [0002] At present, cooling equipment is required to be installed on the converters of electric locomotives to dissipate heat from the IGBT (Insulated Gate Bipolar Transistor) module, so as to ensure the normal operation of all related equipment. Among them, such as figure 1 As shown, the cooling device is usually a water-cooled plate 01, and the IGBT module is mounted on the water-cooled plate 01. The cooling water is forced to pass through the water tank under the panel to take away the heat generated by the IGBT module. In addition, a plate-fin radiator, Fans, water pumps, pipelines and other components dissipate the heat contained in the water to the air through forced convection through the plate-fin radiator. [0003] However, the equipment of this cooling method takes up a lot of space and consumes a lot of energy for operation. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367H01L23/467H01L23/473
CPCH01L23/367H01L23/467H01L23/473
Inventor 金伟陈传国
Owner 株洲时代金属制造有限公司
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