Method for packaging microfluidic chip

A technology of microfluidic chips and packaging methods, applied in chemical instruments and methods, laboratory containers, electrical components, etc., can solve liquid leakage, affect the cross-sectional shape of microfluidic structures, and reduce the operating accuracy of microfluidic chips and other problems to achieve the effect of accelerating volatilization, ensuring high strength and high reliability

Active Publication Date: 2017-03-22
CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
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Problems solved by technology

In hot-press packaging, the hard polymer chip is heated, and the microfluidic structure is easy to collapse, which seriously affects the cross-sectional shape of the microfluidic structure and reduces the operation accuracy of the microfluidic chip for micro-fluids
Moreover, thermocompression bonding is easily affected by the micro-warping of the polymer chip, which makes the bonding strength insufficient, the reliability is not high, and liquid leakage is prone to occur

Method used

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  • Method for packaging microfluidic chip
  • Method for packaging microfluidic chip
  • Method for packaging microfluidic chip

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Embodiment Construction

[0043] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0044] According to the background technology, during the laser engraving or precision machining process of the microfluidic chip, the edge surface of the microfluidic structure on the hard polymer chip will be heated, and the phenomenon of polymer material recasting will occur, and there will be stress generation. When using an organic binder for encapsulation, the organic binder will be in contact with the microfluidic structure, causing the recasting stress...

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Abstract

The invention provides a method for packaging a microfluidic chip. The method comprises the following steps: providing a first substrate and a second substrate; forming a groove-shaped micro channel structure on a first surface of the first substrate; forming a thermoplastic film layer on the surface of the first substrate and the surface of the second substrate; covering an organic adhesive on the first surface of the second substrate; covering the first surface of the first substrate on the first surface of the second substrate to form an integrated packaging structure; and performing heat treatment on the integrated packaging structure until the organic adhesive is completely volatilized. By adoption of the method, the problem of fracturing of a microfluidic structure in the microfluidic chip is solved, and the high strength, high reliability and light transmission of the microfluidic chip are guaranteed.

Description

technical field [0001] The invention relates to the technical field of hard polymer microfluidic chip packaging technology, and more specifically, relates to a method for packaging a microfluidic chip. Background technique [0002] The microfluidic chip for biochemical detection is a multifunctional chip, which integrates the basic operation units involved in biochemical detection, such as sample preparation, quantitative injection, liquid mixing, biochemical reaction and separation detection, on a chip of several square centimeters , a technical platform used to replace various functions of conventional chemical or biological laboratories. [0003] The basic feature and biggest advantage of microfluidic chips are the flexible combination and large-scale integration of various unit technologies on an overall controllable micro platform. At present, the microfluidic structure on the microfluidic chip made of hard polymer materials (such as polyethylene (PC), PMMA) is general...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56B01L3/00
CPCH01L21/56B01L3/00
Inventor 邓永波纪元吴一辉刘永顺
Owner CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
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