Appearance inspection method and inspection system of inkless wafer

Abstract

The invention relates to an appearance inspection method and inspection system of an inkless wafer. The system comprises a reading device, a mobile carrying table, an image acquisition device, a display device, a control device and a vernier device. The application method comprises the steps of reading a wafer sequence number, wherein the display device displays a wafer mapping map; placing the wafer on the mobile carrying table, and adjusting the focal length of the image acquisition device, wherein the display device displays a wafer image of the wafer; correcting positions of the wafer mapping map and the wafer image which are displayed by the display device so that the wafer mapping map and the wafer image are corresponding to each other; visually inspecting the wafer image at the display device, clicking defect crystal grain by the vernier device if the defect crystal grain is found, updating record by the control device, and displaying the position of the defect crystal grain in the wafer mapping map. Therefore, an inkless inspection program is imported, and the visual inspection and the inspection quality are improved.

Description

technical field [0001] The present invention belongs to the technical field of the appearance inspection of a wafer without ink dots, and in particular refers to a wafer map that does not need to directly print ink dots on the wafer after the visual inspection, but can obtain a wafer map indicating the position of the defective grain ( wafer mapping) design. Background technique [0002] A semiconductor chip (semiconductor chip) is manufactured by laminating and forming several layers of circuit patterns on a substrate (substrate) of a wafer (wafrer). After the manufacturing is completed, the wafer will undergo multiple electrical or performance inspections, and finally a visual inspection. During the process, the unqualified die will be marked with ink to distinguish the good from the bad. Then the tested wafers will be sent to the packaging factory, so that the packaging factory can cut the wafer into several chips and package them. After packaging, the chips will go thro...

AI Technical Summary

Problems solved by technology

[0004] 1) The operation of ink dots on the wafer must rely on the ink printer, which is visually inspected and operated by the operator, and the production efficiency is low;

[0005] 2) The thick dots of the ink dots are prone to unevenness, which cannot meet the manufacturer’s requirements for consistent thickness. Some wafers often have different or uneven thicknesses of ink dots, which seriously affect the quality of wafer ink dots;

[0006] 3) The ink dots are directly marked on the wafer. If paper records are required, they must be filled in manually. If you want to manage the records more efficiently or log them into the computer, additional work is required, making it impossible to effectively collect relevant data and computer Digitization also makes it impossible to analyze and research big data

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