Waveguide three-dimensional spot-size converter with protruding surface and making method thereof

Abstract

The invention discloses a waveguide three-dimensional spot-size converter, which comprises a substrate in a flat plate shape, a lower wrapping layer arranged on the substrate and a core layer arranged on the lower wrapping layer for transmitting and converting optical spots. The waveguide three-dimensional spot-size converter is characterized in that the core layer comprises a wedge with changed widths along the light propagation direction; multiple bar-shaped protrusions are arranged on the surface of the wedge; the included angle between the bar-shaped protrusions and the light propagation direction is between -45 DEG to 45 DEG; and the height of the bar-shaped protrusion and the width of the wedge are changed according to a predetermined law. The invention also discloses a method of making the waveguide three-dimensional spot-size converter.

Description

technical field [0001] The invention relates to the field of optoelectronic technology, in particular to a design of a three-dimensional mode spot converter based on a surface protrusion of a waveguide wedge structure, and a preparation method for the three-dimensional structure using a semiconductor micromachining process. Background technique [0002] In recent years, with the maturity and gradual practical application of high-speed and large-capacity optical communication technology, people have put forward higher and higher requirements for the integration of optoelectronic devices. Materials with high refractive index difference can greatly reduce the size and size of waveguides. The size of the bending radius is a good choice for making highly integrated optoelectronic devices. Although small-sized waveguides have broad application prospects, the mode spot conversion between them and large-sized waveguides has always been a serious problem. For example, there is a seri...

AI Technical Summary

Problems solved by technology

However, in the manufacture of 3D mold spot converters, how to use the existing semiconductor micromachining technology to realize the dimensional change in the vertical direction has become a new difficulty

Existing methods for making three-dimensional slopes include making grayscale masks, oblique imprinting, and multiple exposure etching, etc. The processes are complex and costly, and cannot be widely used.

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