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Flower basket for cleaning polycrystalline silicon sheet

A technology of polycrystalline silicon wafers and flower baskets, which is applied in the directions of cleaning methods using liquids, cleaning flexible items, cleaning methods and utensils, etc., can solve problems such as defects and scratches on the edge of silicon wafers, so as to reduce edge scratches and avoid cards. , the effect of good application prospects and market value

Inactive Publication Date: 2017-04-26
XIAN FENGHUO PHOTOVOLTAIC TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to overcome the problems of chip cards, fragments and scratches or defects on the edges of silicon chips at the bottom of the flower basket during the insertion and ultrasonic cleaning of polycrystalline flower baskets in the existing silicon wafer cleaning process

Method used

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  • Flower basket for cleaning polycrystalline silicon sheet
  • Flower basket for cleaning polycrystalline silicon sheet
  • Flower basket for cleaning polycrystalline silicon sheet

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Embodiment Construction

[0019] In order to further illustrate the technical means and effects adopted by the present invention to achieve the intended purpose, the specific implementation, structural features and effects of the present invention will be described in detail below in conjunction with the accompanying drawings and examples.

[0020] Such as figure 1 As shown, a schematic diagram of the structure of a flower basket for cleaning polysilicon wafers, including a flower basket body 1, a support bar 2, a support plate 3, and an insert groove 4, wherein the support plate 3 is made of soft rubber material; the flower basket The insert grooves 4 on both sides of the body 1 are all pierced with a support bar 2 perpendicular to the insert groove 4, and the connection between the support bar 2 and the insert groove 4 and the silicon chip is provided with a Adapted chamfering; two support rods 2 are provided on both sides of the flower basket body 1, one is set at a position 1 / 2 from the bottom of ...

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Abstract

The invention belongs to the field of cutting and cleaning photovoltaic polycrystalline silicon sheets and particularly relates to a flower basket for cleaning a polycrystalline silicon sheet. The flower basket comprises a flower basket body, supporting retaining rods, supporting plates and plugging sheet grooves. Two supporting retaining rods are arranged on each of the left and right sides of the flower basket body, and chamfers matched with the polycrystalline silicon sheet are arranged at the connections of the supporting retaining rods and the plugging sheet grooves and the polycrystalline silicon sheet; the supporting plates are made from soft rubber materials; by designing the distance between the supporting retaining rods and the structures thereof, undesirable phenomena such as locking, breaking of the polycrystalline silicon sheet are further effectively avoided while the bottom strength of the flower basket is guaranteed; by virtue of the design of the supporting plates in the bottom of the flower basket, problems of scratches at the edges and defects at the edges of the polycrystalline silicon sheet can be reduced. The flower basket for cleaning the polycrystalline silicon sheet is high in cleaning efficiency, brings extreme convenience to operators in cleaning work, and has a good application prospect and market value.

Description

technical field [0001] The invention belongs to the field of cutting and cleaning of photovoltaic polycrystalline silicon wafers, and in particular relates to a [0002] A flower basket for silicon wafer cleaning. Background technique [0003] The principle of polysilicon wafer cleaning can be explained by the phenomenon of "cavitation": that is, when the sound wave pressure propagated by ultrasonic vibration in the liquid reaches an atmospheric pressure, its power density is 0.35 watts / cm, and the peak value of the ultrasonic sound wave pressure can reach a vacuum. Or negative pressure, but in fact there is no negative pressure, so a large pressure is generated in the liquid, which will tear the liquid molecules into cavities. This cavity is very close to a vacuum, and it ruptures when the ultrasonic pressure reverses to the maximum. The strong impact caused by the rupture will knock down the pollutants on the surface of the silicon wafer. This impact phenomenon caused by ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B13/00B08B3/12
CPCB08B13/00B08B3/12B08B11/02
Inventor 拜鹏高伟朱菲菲张瑞峰
Owner XIAN FENGHUO PHOTOVOLTAIC TECH