Electromagnetism attached copper-aluminum composite wire production device

Abstract

The invention related to cable production equipment, and in particular relates to an electromagnetism attached copper-aluminum composite wire production device. The electromagnetism attached copper-aluminum composite wire production device comprises a paying off mechanism and a taking up mechanism used for releasing and rolling a wire, wherein a chemical cleaning device, a pre-plating device and a main plating device are sequentially arranged on a wire transferring passage between the paying off mechanism and the taking up mechanism; the main plating device comprises a main plating tank around which an electromagnetic device capable of generating a stirring electromagnetic field in the main plating tank is arranged. Compared with existing production equipment, the production device provided by the invention can improve composite compactness, and is small in pollution, easy to control stirring strength, and improved in plating quality.

Description

technical field [0001] The invention relates to a cable production equipment, in particular to a preparation device for an electromagnetically added copper-aluminum composite wire. Background technique [0002] With the rapid development of my country's electric power industry, the demand for power transmission equipment, motors, etc. is also increasing, and the manufacture of power transmission equipment and coils requires a large amount of high-conductivity copper, but my country's copper resources are relatively scarce, and its 40%~50% Most of the copper materials are dependent on imports, which has caused the price of copper to rise continuously in recent years and increased the manufacturing cost of enterprises. In order to reduce costs, copper substitute products have gradually appeared in the market. For example, using the characteristics of my country's rich aluminum resources, copper / aluminum composite wires are prepared, and a small amount of copper is combined with...

AI Technical Summary

Problems solved by technology

[0003] At present, the common preparation method of copper / aluminum composite conductive wire in the market is the coating method. The outer surface of the aluminum wire is coated concentrically with a high-purity copper strip, and the required conductive wire is made through multi-pass drawing and heat treatment. Products, compared with pure copper conductors, copper / aluminum composite conductors have obvious advantages: light weight, soft wire quality, low cost, saving copper resources, etc., but there are the following defects when preparing copper / aluminum composite conductors by coating method: 1. The copper content in the wire is still relatively large, and its copper weight ratio is about 40%, and the material cost is relatively high; 2. The bonding fastness between the two metals is insufficient. After production, some finished products can see gaps from the section, which affects Conductor quality and conductivity

[0004] Chinese patent 200710130942.1 proposes an electroplating preparation method for copper / aluminum composite wires. By adopting the method of electroplating copper on the surface of aluminum wires, a composite wire product with a relatively small weight of copper and a denser combination of the two metals is prepared. Compared with the coating method This preparation method has obvious quality and cost advantages, but there are still some shortcomings when the electroplating production method proposed in this patent is directly used in the production of copper / aluminum composite wires: it is difficult to completely remove the oxide film on the surface of aluminum wires only by chemical cleaning. Clean up; in order to make the electrolytic copper plated on the surface of the product evenly distributed, the copper sulfate solution on the surface of the product is stirred by blowing gas during electroplating, but the stirring intensity of the gas stirring method is limited, the stirring is uneven, and the blowing gas will mix impurities Bring it into the electroplating tank, pollute the solution, and make the plating solution contact with the air, which is easy to pollute the solution, which is not conducive to improving the quality of electroplating, and the bonding strength between copper and aluminum after electroplating is not high

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