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Cmp slurry compositions and methods for aluminum polishing

A technology of polishing composition and compound, applied in the direction of chemical instruments and methods, polishing composition containing abrasives, other chemical processes, etc., can solve problems affecting the polishing rate, etc.

Active Publication Date: 2017-05-10
CMC材料有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Aluminum oxide is much harder than aluminum metal, and oxide formation can affect the polishing rate

Method used

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  • Cmp slurry compositions and methods for aluminum polishing
  • Cmp slurry compositions and methods for aluminum polishing
  • Cmp slurry compositions and methods for aluminum polishing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] This example illustrates the use of various compositions comprising different abrasive particles for polishing aluminum.

[0039] 6061 series aluminum alloy substrates were polished for 15 minutes using various abrasive materials on a GnP POLI-500 polishing apparatus (Busan, G&P Technology, South Korea) equipped with an EPIC D100 polishing pad (Cabot Micro Microelectronics, Aurora, IL) . The polishing parameters were: a platform speed of about 80 rpm, a club head speed of about 74 rpm, a downforce of about 2.0 psi, and a slurry flow rate of about 100 mL / minute.

[0040] Various CMP compositions having the formulations shown in Table 1 were prepared. The aluminum alloy substrate was polished for 15 minutes using the composition as described above.

[0041] Table 1

[0042]

[0043]

[0044] *Alumina abrasive grain surface - coated with poly(2-acrylamido-2-methylpropanesulfonic acid).

[0045] The results of polishing aluminum alloys using the various compositio...

Embodiment 2

[0050] This example illustrates the use of an anionic polymer coated alumina abrasive to polish aluminum alloys. A 6063 aluminum alloy substrate was polished using the coated alumina abrasive of Example IE. Compositions were prepared from a 12 wt% stock suspension of abrasive at a pH of about 3 to 5, diluted (3x) with deionized water to achieve a final abrasive concentration of about 4 wt%. The composition was used to polish aluminum alloy substrates as described in Example 1 on a CMP apparatus polishing apparatus equipped with a polishing pad. The polishing parameters were: a platform speed of about 80 rpm, a club head speed of about 74 rpm, a downforce of about 2.0 psi, and a slurry flow rate of about 100 mL / minute. On visual inspection, the polished surface had a better quality than that obtained with the same polishing composition but with an uncoated alumina abrasive at a concentration of 1% by weight. However, visual inspection of the polished surface revealed some scr...

Embodiment 3

[0052] This example illustrates a CMP comprising the coated alumina abrasive of Example 1 (1% by weight) in combination with 1-hydroxyethylidene-1,1-diphosphonic acid (0.3% by weight) as a polishing accelerator Composition use.

[0053] Using the same CMP equipment and conditions as described in Example 1, a 6063 aluminum alloy substrate was polished using the CMP composition. Visual inspection of the polished surface revealed a surface quality better than that observed in Example 2 for the coated alumina abrasive alone. Surfaces polished according to this example showed no underpolishing, minimal scratches, and no other visible defects. While not wishing to be bound by theory, it is believed that the improvement in the polished surface may be a result of lower polishing pad temperatures resulting from the use of polishing accelerator compounds.

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Abstract

Chemical-mechanical polishing (CMP) compositions and methods are described, which are suitable for polishing an aluminum surface. The compositions comprise alumina abrasive particles coated with an anionic polymer, and suspended in an acidic or neutral pH carrier. In some cases, a polishing aid such as silica, a carboxylic acid, a phosphonic acid compound, or a combination thereof may be added to the CMP compositions. The described CMP compositions and methods improve polishing efficacy and reduce surface imperfections on a polished aluminum surface compared to CMP methods using uncoated alumina abrasive.

Description

[0001] Cross References to Related Applications [0002] This patent application claims priority to US Provisional Patent Application No. 62 / 015,084, filed June 20, 2014, which is hereby incorporated by reference in its entirety. technical field [0003] The present invention relates to polishing compositions and methods for polishing aluminum alloys. More particularly, the present invention relates to chemical mechanical polishing compositions and methods for polishing aluminum surfaces to a high quality, mirror finish using polymer coated alumina abrasives. Background technique [0004] Aluminum is commonly used as a conductive material forming wiring and / or conductive plugs in semiconductor devices, and is also used to produce metal mirrors, housings and other parts or elements used in the manufacture of various devices and articles. Aluminum and aluminum alloys can also be deposited in layers to create decorative coatings for the surfaces of various industrial and consu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K3/14H01L21/304
CPCC23F3/02C09G1/02C23F3/03
Inventor 吕龙岱刘文政陈瑞清
Owner CMC材料有限责任公司