Automatic photoetching plate feeding and taking device of chip photoetching machine

Abstract

The invention discloses an automatic photoetching plate feeding and taking device of a chip photoetching machine. The automatic photoetching plate feeding and taking device comprises a machine base. A lifting base is arranged on the machine base in a vertical lifting manner and provided with a horizontal base. The horizontal base is provided with a material taking mechanism. The material taking mechanism comprises a support. A first absorbing plate and a second absorbing plate are arranged on the support in a sliding manner and are the same in sliding direction, the sliding direction of the first absorbing plate and the sliding direction of the second absorbing plate are perpendicular to the sliding direction of the horizontal base, and the support is provided with a synchronous opening and closing mechanism. Each of the first absorbing plate and the second absorbing plate is provided with a negative pressure suction port. The negative pressure suction ports correspond to the edge of the lower plate face of a photoetching plate. The first absorbing plate or the second absorbing plate is driven by an opening and closing power device. The opposite sides of the first absorbing plate and the second absorbing plate are provided with avoiding concave openings. The automatic feeding and taking device enters from the two sides of the photoetching plate through opening and closing of the first absorbing plate and the second absorbing plate and directly adsorbs the photoetching plate; and the first absorbing plate and the second absorbing plate do not make contact with a plate film, so that plate film abrasion or tearing is avoided.

Description

technical field [0001] The invention relates to an automatic feeding and retrieving device, in particular to an automatic feeding and retrieving device for a photolithography plate of a chip photolithography machine. Background technique [0002] In the production process of integrated circuit chips, the exposure transfer (photolithography) of the design pattern of the chip on the photoresist on the surface of the silicon wafer is one of the most important processes. The equipment used in this process is called a photolithography machine (exposure machine). Lithography machine is the most critical equipment in the process of integrated circuit processing. [0003] However, during the photolithography process, the photoresist plate needs to be sent to the photoresist plate adsorption base by an automatic retrieving device or the photoresist plate on the photoresist plate adsorption base is taken away. It is only suitable for glossy photolithography plates. The current autom...

AI Technical Summary

Problems solved by technology

However, due to the improvement and improvement of the photolithography process, the upper and lower surfaces of the photolithography plate will be bonded with the plate film, which is thin and easy to wear and tear. For the lithography plate of the film, when the insertion plate is inserted under the lithography plate to take the material, it is easy to contact the surface or edge of the plate film and cause the plate film to wear or tear, so that it cannot meet the subsequent lithography requirements

Images