Fan-out type wafer level encapsulation structure and preparation method thereof
A wafer-level packaging, fan-out technology, used in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve the problems of packaging structure interface delamination risk, high difficulty and cost, and impact on reliability, etc. Achieve the effect of avoiding the risk of interface delamination, improving packaging efficiency and improving reliability
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[0097] The following describes the implementation of the present invention through specific specific examples. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.
[0098] See figure 2 The first embodiment of the present invention relates to a fan-out wafer-level packaging structure. It should be noted that the illustrations provided in this embodiment mode only illustrate the basic idea of the present invention in a schematic manner. The figures only show the components related to the present invention instead of the number, shape, and shape of the components in actual implementation. For size drawin...
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