Unlock instant, AI-driven research and patent intelligence for your innovation.

Anti-oxidation manufacturing method of circuit board

A production method and circuit board technology, applied in the directions of printed circuit manufacturing, printed circuits, electrical components, etc., can solve the problems of unsafe, tank liquid blocking holes, high production labor intensity, etc., to eliminate hidden safety hazards, reduce labor intensity, The effect of reducing the chance of plugging holes

Active Publication Date: 2017-05-17
SHENZHEN SUNTAK MULTILAYER PCB
View PDF4 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims at the problems of high labor intensity, hole blockage and unsafety of the existing circuit board production method, and provides an anti-oxidation production method of the circuit board. chance of holes, and eliminates the safety hazard of manual operation

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] An anti-oxidation manufacturing method for circuit boards shown in this embodiment includes the following processing steps in sequence: material cutting→inner layer circuit making→pressing→drilling→copper sinking→copper sinking post-treatment→full board electroplating pre-treatment→ Full board electroplating→outer layer circuit making→solder mask→silk printing characters→surface treatment→forming, the specific steps are as follows:

[0017] a. Cutting: Cut out the core board according to the panel size 520mm×620mm, and the thickness of the core board is 0.5mm H / H;

[0018] b. Inner layer circuit production (negative film process): Inner layer graphics transfer, use a vertical coating machine to coat photosensitive film, the thickness of the photosensitive film is controlled to 8 μm, use a fully automatic exposure machine, and use a 5-6 grid exposure ruler (21 grids) Exposure ruler) to complete the exposure of the inner layer circuit; inner layer etching, etch out the ci...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an anti-oxidation manufacturing method of a circuit board. The manufacturing method sequentially comprises the following procedures of cutting, internal line manufacturing, laminating, drilling, copper deposition, copper deposition post-treatment, full-board electroplating pretreatment, full-board electroplating, external line manufacturing, resistance welding, screen printing of characters, surface treatment and molding, wherein the method of copper deposition post-treatment comprises the steps of sequentially cleaning a production board by using overflow water and a potassium permanganate water solution and forming a potassium permanganate anti-oxidation layer on the surface of the production board. According to the method, the board soaking process of a board conserving groove before full-board electroplating after copper deposition is concealed in the manufacturing process of the circuit board, the labor intensity of operation of a worker is effectively reduced through copper deposition post-treatment on the production board after copper deposition, the probability of blockage of a copper sheet is reduced and the potential safety hazard of manual operation is eliminated.

Description

technical field [0001] The invention relates to the technical field of manufacturing printed circuit boards, in particular to an anti-oxidation manufacturing method for circuit boards. Background technique [0002] In the production process of printed circuit boards, after the copper sinking operation of the gantry vertical copper wire and before the electroplating operation of the whole board, in order to prevent the production board from being oxidized, the production board is generally placed in the feeding tank before the full board electroplating with the sub-basket. Pickling (1% dilute sulfuric acid) treatment, the process is as follows: After the copper sinks out of the board, the production board is placed in the sub-basket uniformly, and then the sub-basket with the production board is placed in the board maintenance tank. When the whole board is electroplated, Take out the production plate from the sub-basket in the plate-raising tank, and then carry out the whole ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/18
CPCH05K3/18H05K2203/0723H05K2203/0766H05K2203/0789
Inventor 吴樟友韩焱林
Owner SHENZHEN SUNTAK MULTILAYER PCB