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High capacity semiconductor film deposition device

A thin-film deposition device and semiconductor technology, which is used in semiconductor/solid-state device manufacturing, transportation and packaging, conveyor objects, etc., can solve problems such as long waiting time for equipment, and achieve the effect of compact and reasonable structure and meeting the requirements of use.

Inactive Publication Date: 2017-05-24
PIOTECH CO LTD
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  • Abstract
  • Description
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Problems solved by technology

At present, the reaction chamber, the storage chamber, and the transfer chamber are processed in a single cycle, and the waiting time for the equipment is long

Method used

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  • High capacity semiconductor film deposition device
  • High capacity semiconductor film deposition device

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Embodiment Construction

[0008] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0009] Such as figure 1 and figure 2 Shown: a high-yield semiconductor thin film deposition device, including a pre-equipment 1, a storage chamber 2, a transfer chamber 3 and a reaction chamber 4. The pre-equipment 1 is connected to the storage chamber 2 through a gate valve, and the wafer lifting mechanism 6 is located in the storage chamber 2 . The storage chamber 2 is connected with the film delivery chamber 3 . The film transfer chamber 3 is connected ...

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Abstract

The invention provides a high capacity semiconductor film deposition device which comprises front-end equipment (1), a storage cavity (2), a film transfer cavity (3), and reaction cavities (4). The front-end equipment (1) is connected to the storage cavity (2) through a valve (2). A wafer lifting mechanism is in the storage cavity (2). The storage cavity (2) is connected with the film transfer cavity (3). The film transfer cavity (3) is connected with the three reaction cavities (4). The storage cavity (2) is equipped with the wafer lifting mechanism inside. The film transfer cavity (3) is equipped with double layers of manipulators inside. The structure of the high capacity semiconductor film deposition device is reasonable, and the requirement of usage can be satisfied.

Description

technical field [0001] The invention relates to a deposition device, especially a high-capacity semiconductor film deposition device, which is mainly used in semiconductor devices. Background technique [0002] With the development of semiconductor technology, there is a need to improve the operating efficiency of equipment. At present, the reaction chamber, the storage chamber, and the transfer chamber are processed in a single cycle, and the waiting time for the equipment is long. Contents of the invention [0003] Aiming at the deficiencies of the above-mentioned prior art, the present invention provides a high-capacity semiconductor film deposition device. [0004] To achieve the above purpose, the technical solution adopted by the present invention is: a high-yield semiconductor thin film deposition device, including pre-equipment (1), storage chamber (2), film transfer chamber (3) and reaction chamber (4). The pre-equipment (1) is connected to the storage chamber (...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/20H01L21/677
Inventor 刘忆军续震王燚
Owner PIOTECH CO LTD
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