A curved surface deformation manipulator for flexible film transfer

Abstract

The invention belongs to the field of material transport and transfer related equipment and discloses a curved-surface deformation manipulator facing to flexible-film transfer. The curved-surface deformation manipulator comprises a linear drive assembly, a seal assembly, an air pressure assembly and an adjustable sliding assembly; the linear drive assembly is used for providing for up-down drive displacement and is a main drive mechanism that forms a free curved surface; the seal assembly comprises an upper connecting plate, a lower connecting plate, a sealing film, a breathable film and the like and cooperates with the air pressure assembly to form a positive pressure chamber and a negative pressure chamber, and function of the manipulator in adsorbing and releasing a flexible film sequentially is correspondingly realized; the adjustable sliding assembly is used for adjusting relative positions among multiple linear actuators. Accordingly, the entire process that the flexible film is transferred to the target curved surface form a plane substrate can be efficiently realized; the curved-surface deformation manipulator has the advantages of compact structure, convenience in control, high precision, less damage to the film and the like, and more adaptability and free adjustment capacity are achieved in formation of the free curved surface.

Description

technical field [0001] The invention belongs to the field of equipment related to material conveying and transfer, and more specifically relates to a curved surface deformation manipulator for flexible film transfer. Background technique [0002] Flexible curved surface electronics has the characteristics of large area, deformability, light weight and non-planar, and has the incomparable advantages of planar silicon-based microelectronics / sensors. Therefore, it has shown huge development space in the fields of aerospace, information communication, and health care. and application prospects. However, when transferring electronics on flexible curved surfaces such as aircraft smart skins, it is often necessary to transfer and fix the pre-treated electronic film on a flat substrate to the target curved surface after adsorption. This process directly affects the quality of the final product. Reliability is therefore one of the key manufacturing links. [0003] In the current pr...

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Problems solved by technology

[0003] In the current prior art, some schemes for pick-up or placement transfer of objects such as chips have been proposed, such as early patents such as CN201420671749.4, CN200910272685.4, etc. How to deal with the curved surface; In addition, the method of using soft stamps to absorb and imprint the film has also been proposed in the prior art, but the actual test shows that it often leads to excessive deformation force during the transfer process , aggravate the cracking of electronic devices in flexible films, and there are problems such as insufficient transfer accuracy

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