Sulfur Vapor Corrosion Chamber and Test Method for Sulfur Vapor Corrosion

A corrosion test, sulfur vapor technology, applied in the direction of weather resistance/light resistance/corrosion resistance, measuring devices, instruments, etc., can solve the problems such as the inability to carry out the corrosion test of the whole server, the long MFG test time, and the easy occurrence of peeling corrosion. The effect of high test accuracy and consistency, shortened test time and accurate control

Active Publication Date: 2020-03-24
LENOVO (BEIJING) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] 2. Exfoliation corrosion is prone to occur in MFG test
[0008] 4. The maximum size of the existing MFG test box is only 800mm
Therefore, only components can be put in, and the corrosion test of the whole server cannot be carried out
[0009] 5. The test time of existing MFG is longer, such as 12-16 days
[0010] 6. The existing MFG can only be tested for one working condition
For example, when two products need to be tested in different test environments (for example, G3(Harsh) and G2(Moderate)), they need to be tested one by one, which takes longer

Method used

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  • Sulfur Vapor Corrosion Chamber and Test Method for Sulfur Vapor Corrosion
  • Sulfur Vapor Corrosion Chamber and Test Method for Sulfur Vapor Corrosion
  • Sulfur Vapor Corrosion Chamber and Test Method for Sulfur Vapor Corrosion

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Embodiment Construction

[0032] Various preferred embodiments of the present invention will be described below with reference to the accompanying drawings. The following description with reference to the accompanying drawings is provided to assist understanding of example embodiments of the invention as defined by the claims and their equivalents. It includes various specific details to aid in understanding but they are to be regarded as exemplary only. Accordingly, those of ordinary skill in the art will recognize that various changes and modifications of the embodiments described herein can be made without departing from the scope and spirit of the invention. Also, detailed descriptions of functions and constructions well-known in the art will be omitted to make the description clearer and more concise.

[0033] First, refer to figure 1 An overview of a sulfur vapor corrosion chamber according to the present invention is described. like figure 1 As shown, the sulfur vapor corrosion chamber 100 i...

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Abstract

The invention discloses a sulfur vapor corrosion box and a sulfur vapor corrosion testing method. The sulfur vapor corrosion box comprises a test box body part, a sulfur vapor generation part and a parameter control part, wherein the test box body part comprises a partition plate; the partition plate is provided with a gap and is used for placing a to-be-tested sample; the sulfur vapor generation part is arranged below the partition plate and is separated from the test box body part through the partition plate for generating sulfur vapor; the sulfur vapor enters the test box body part through the gap in the partition plate; and the parameter control part is used for independently controlling parameters of the generated sulfur vapor in the test box body part.

Description

technical field [0001] The invention relates to the field of product corrosion life testing, more specifically, to a sulfur vapor corrosion chamber and a sulfur vapor corrosion testing method for product corrosion life testing. Background technique [0002] The purpose of MFG (Mixed Flowing Gas Environmental Test) is that because electronic information products, such as connectors, PC boards and some metal connection parts, will be affected by the external environment and cause corrosion and oxidation stress, resulting in poor conduction, so that The function of the product is impaired, reducing the life of the product. Therefore, an accelerated environment test becomes very important. [0003] The basic test principle is that since the coating on the surface of the copper substrate may have pinholes (Porosity), some gases in the environment, such as NO 2 , SO 2 , ... etc. will penetrate the substrate through pinholes and cause corrosion changes with copper metal, and the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N17/00
CPCG01N17/002G01N17/006
Inventor 江国栋郭强王震宇
Owner LENOVO (BEIJING) LTD
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